Inventor

KOLLER ADOLF

DE26 patents

⚠️ This page may combine multiple inventors who share the name “KOLLER ADOLF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOLLER ADOLF

INFINEON TECHNOLOGIES AG

Semiconductor package

Method of producing a thin semiconductor chip

Singulation processes

Panel, semiconductor device and method for the production thereof

Carrier arrangement and method for processing a carrier by generating a crack structure

Chip comprising a backside metal stack

Singulating semiconductor wafers to form semiconductor chips

Semiconductor device and method

Method with stealth dicing process for fabricating MEMS semiconductor chips

Method of detaching semiconductor material from a carrier and device for performing the method

Wafer expander

Semiconductor device with circumferential structure and method of manufacturing

Method for manufacturing a plurality of chips

Substrate removal from a carrier

Chip comprising a fill structure

Removal of a reinforcement ring from a wafer

KOLLER ADOLF

Semiconductor device

Sensor

Panel, semiconductor device and method for the production thereof

Electronic light emitting device and method for fabricating the same

VAUPEL MATHIAS

Separation of semiconductor devices from a wafer carrier

MICCOLI GIUSEPPE

Method of dicing a wafer

THEUSS HORST

Semiconductor package

ELIAN KLAUS

GMR sensor within molded magnetic material employing non-magnetic spacer

SCHNEEGANS MANFRED

Method for producing a semiconductor component

MACKH GUNTHER

Chip comprising a fill structure