P

Inventor

BU XIAOMEI

SG7 patents
⚠️ This page may combine multiple inventors who share the name “BU XIAOMEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHARTERED SEMICONDUCTOR MFG

3 patents
US7094669B2Aug 22, 2006

Structure and method of liner air gap formation

CHARTERED SEMICONDUCTOR MFG46 citations92
US7224060B2May 29, 2007

Integrated circuit with protective moat

CHARTERED SEMICONDUCTOR MFG25 citations89
US7585768B2Sep 8, 2009

Combined copper plating method to improve gap fill

CHARTERED SEMICONDUCTOR MFG14 citations82

GLOBALFOUNDRIES SG PTE LTD

2 patents
US7989338B2Aug 2, 2011

Grain boundary blocking for stress migration and electromigration improvement in CU interconnects

GLOBALFOUNDRIES SG PTE LTD8 citations82
US9054107B2Jun 9, 2015

Reliable interconnect for semiconductor device

GLOBALFOUNDRIES SG PTE LTD2 citations61

AGENCY SCIENCE TECH & RES

1 patent
US6913994B2Jul 5, 2005

Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects

AGENCY SCIENCE TECH & RES20 citations90

ZHANG FAN

1 patent
US8598031B2Dec 3, 2013

Reliable interconnect for semiconductor device

ZHANG FAN2 citations61