Inventor

FEGER CLAUDIUS

US52 patents

⚠️ This page may combine multiple inventors who share the name “FEGER CLAUDIUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FEGER CLAUDIUS

IBM

Physically highly secure multi-chip assembly

Method for accounting for clamp expansion in a coefficient of thermal expansion measurement

Physically highly secure multi-chip assembly

Tamper-responding encapsulated enclosure having flexible protective mesh structure

Method and system for preventing parallel marketing of wholesale and retail items

Tamper-responding encapsulated enclosure having flexible protective mesh structure

Portable computer riser for enhanced cooling

Flat panel display containing black matrix polymer

Method and system for preventing parallel marketing of wholesale and retail items

Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases

Bilayer wafer-level underfill

Moisture and ion barrier for protection of devices and interconnect structures

Moisture and ion barrier for protection of devices and interconnect structures

Acid-cleavable acetal and ketal based epoxy oligomers

Method of applying flex tape protective coating onto a flex product

Nanoparticle design for enhanced oil recovery

Solder interconnect structure and method using injection molded solder

Electrical connecting device and method of forming same

Method and integrated device for analyzing liquid flow and liquid-solid interface interaction

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

Flex tape protective coating

Wet etching of thermally or chemically cured polyimide

Low k dielectric materials with inherent copper ion migration barrier

Morphological composite materials formed from different precursors

Method and integrated device for analyzing liquid flow and liquid-solid interface interaction

Operation of diagnostic devices involving microchannels and electrodes

Tunable miniaturized physical subsurface model for simulation and inversion

Efficient backlighting for a portable display

Coated means for connecting a chip and a card

Low k dielectric materials with inherent copper ion migration barrier

Solid state extension method

Nanoparticle design for enhanced oil recovery

Forming constant diameter spherical metal balls

Reversible thermal thickening grease

Method and apparatus for thermally induced testing of materials under transient temperature

Operation of diagnostic devices involving microchannels and electrodes

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

Method and system for collecting alignment data from coated chips or wafers

Apparatus and methods for remakeable connections to optical waveguides

Apparatus and methods for remakeable connections to optical waveguides

Injection-molded solder (IMS) tool assembly and method of use thereof

Trapping at least one microparticle

FEGER CLAUDIUS

No flow underfill or wafer level underfill and solder columns

Injection molded solder process for forming solder bumps on substrates

Heat transfer control structures using thermal phonon spectral overlap

Injection molded solder process for forming solder bumps on substrates

Forming constant diameter spherical metal balls

Vacuum extrusion method of manufacturing a thermal paste

OGGIONI STEFANO S

Multilayer securing structure and method thereof for the protection of cryptographic keys and code