Inventor
STAFFORD JOHN W
US26 patents
⚠️ This page may combine multiple inventors who share the name “STAFFORD JOHN W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
20 patentsUS5818404AOct 6, 1998
Integrated electro-optical package
MOTOROLA INC95 citations98
US5739800AApr 14, 1998
Integrated electro-optical package with LED display chip and substrate with drivers and central opening
MOTOROLA INC112 citations98
US5789815AAug 4, 1998
Three dimensional semiconductor package having flexible appendages
MOTOROLA INC167 citations97
US5120678AJun 9, 1992
Electrical component package comprising polymer-reinforced solder bump interconnection
MOTOROLA INC227 citations97
US5892661AApr 6, 1999
Smartcard and method of making
MOTOROLA INC127 citations96
US5838703ANov 17, 1998
Semiconductor laser package with power monitoring system and optical element
MOTOROLA INC77 citations96
US5699073ADec 16, 1997
Integrated electro-optical package with carrier ring and method of fabrication
MOTOROLA INC66 citations96
US5627931AMay 6, 1997
Optoelectronic transducer
MOTOROLA INC75 citations96
US5432358AJul 11, 1995
Integrated electro-optical package
MOTOROLA INC68 citations96
US5221426AJun 22, 1993
Laser etch-back process for forming a metal feature on a non-metal substrate
MOTOROLA INC55 citations96
US5816478AOct 6, 1998
Fluxless flip-chip bond and a method for making
MOTOROLA INC64 citations95
US5194137AMar 16, 1993
Solder plate reflow method for forming solder-bumped terminals
MOTOROLA INC69 citations94
US5160409ANov 3, 1992
Solder plate reflow method for forming a solder bump on a circuit trace intersection
MOTOROLA INC70 citations94
US5905750AMay 18, 1999
Semiconductor laser package and method of fabrication
MOTOROLA INC42 citations93
US5650640AJul 22, 1997
Integrated electro-optic package
MOTOROLA INC36 citations93
US5689279ANov 18, 1997
Integrated electro-optical package
MOTOROLA INC22 citations92
US5612549AMar 18, 1997
Integrated electro-optical package
MOTOROLA INC44 citations92
US5602491AFeb 11, 1997
Integrated circuit testing board having constrained thermal expansion characteristics
MOTOROLA INC28 citations92
US5217597AJun 8, 1993
Solder bump transfer method
MOTOROLA INC49 citations89
US5446247AAug 29, 1995
Electrical contact and method for making an electrical contact
MOTOROLA INC23 citations88
AMP INC
5 patentsUS4752109AJun 21, 1988
Optoelectronics package for a semiconductor laser
AMP INC143 citations97
US4818053AApr 4, 1989
Optical bench for a semiconductor laser and method
AMP INC29 citations92
US4762395AAug 9, 1988
Lens assembly for optical coupling with a semiconductor laser
AMP INC26 citations92
US4762386AAug 9, 1988
Optical fiber assembly including means utilizing a column load to compensate for thermal effects
AMP INC19 citations82
US4997279AMar 5, 1991
Optical bench for a semiconductor laser and method
AMP INC15 citations73