Inventor

ZARBOCK EDWARD A

US9 patents

⚠️ This page may combine multiple inventors who share the name “ZARBOCK EDWARD A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

5 patents

US6924551B2Aug 2, 2005

Microelectronic package with carbon nanotubes interconnect and method of making same

INTEL CORP13 citations79

US7629203B2Dec 8, 2009

Thermal interface material for combined reflow

INTEL CORP5 citations61

MA QING

1 patent

US9368429B2Jun 14, 2016

Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

MA QING86 citations97

ZARBOCK EDWARD A

1 patent

US9570883B2Feb 14, 2017

Photonic package architecture

ZARBOCK EDWARD A43 citations90

SANKMAN ROBERT L

1 patent

US9190388B2Nov 17, 2015

Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate

SANKMAN ROBERT L1 citations50

MOTOROLA INC

1 patent

US6376007B1Apr 23, 2002

Method of marking glass

MOTOROLA INC1 citations49

ZARBOCK EDWARD A

INTEL CORP

Through silicon via, folded flex microelectronic package

Chip-to-chip optical interconnect

Linked chip attach and underfill

Microelectronic package with carbon nanotubes interconnect and method of making same

Thermal interface material for combined reflow

MA QING

Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

ZARBOCK EDWARD A

Photonic package architecture

SANKMAN ROBERT L

Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrate

MOTOROLA INC

Method of marking glass