Inventor
ISHIDA HIROFUMI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “ISHIDA HIROFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ELECTROPLATING ENG
5 patentsUS5447615ASep 5, 1995
Plating device for wafer
ELECTROPLATING ENG221 citations98
US5429733AJul 4, 1995
Plating device for wafer
ELECTROPLATING ENG265 citations98
US6224670B1May 1, 2001
Cup-type plating method and cleaning apparatus used therefor
ELECTROPLATING ENG9 citations73
US7179359B2Feb 20, 2007
Cup-shaped plating apparatus
ELECTROPLATING ENG2 citations62
US6736945B2May 18, 2004
Wafer plating apparatus
ELECTROPLATING ENG4 citations60
KONICA MINOLTA INC
5 patentsUS10394157B2Aug 27, 2019
Image forming apparatus
KONICA MINOLTA INC0 citations51
US10054869B2Aug 21, 2018
Image forming apparatus for detecting crack generated in charging member, method for controlling the image forming apparatus, and control program used in the image forming apparatus
KONICA MINOLTA INC1 citations51
US10732556B2Aug 4, 2020
Image forming apparatus and management method for image forming apparatus
KONICA MINOLTA INC0 citations41
US9841708B2Dec 12, 2017
Image forming apparatus having power supply that applies reverse-bias voltage to transfer member
KONICA MINOLTA INC0 citations41
US9081360B2Jul 14, 2015
Image formation apparatus
KONICA MINOLTA INC0 citations41
INTEL CORP
2 patentsUS5871626AFeb 16, 1999
Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects
INTEL CORP163 citations98
US5807469ASep 15, 1998
Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects
INTEL CORP31 citations92