Inventor
CHEN CHIEN-FAN
US30 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIEN-FAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
17 patentsUS7476564B2Jan 13, 2009
Flip-chip packaging process using copper pillar as bump structure
ADVANCED SEMICONDUCTOR ENG51 citations93
US11335646B2May 17, 2022
Substrate structure including embedded semiconductor device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations70
US11139179B2Oct 5, 2021
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG2 citations70
US9768139B2Sep 19, 2017
Semiconductor device and semiconductor package
ADVANCED SEMICONDUCTOR ENG3 citations69
US9508671B2Nov 29, 2016
Semiconductor device and semiconductor package
ADVANCED SEMICONDUCTOR ENG3 citations69
US12267961B2Apr 1, 2025
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations62
US11882660B2Jan 23, 2024
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations62
US11553596B2Jan 10, 2023
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations62
US11032911B2Jun 8, 2021
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations62
US11296030B2Apr 5, 2022
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations61
US10950551B2Mar 16, 2021
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations61
US12469795B2Nov 11, 2025
Substrate structure including embedded semiconductor device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11587881B2Feb 21, 2023
Substrate structure including embedded semiconductor device
ADVANCED SEMICONDUCTOR ENG0 citations56
US11923285B2Mar 5, 2024
Electronic device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations52
US10757813B2Aug 25, 2020
Embedded component package structure and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations52
US9741675B2Aug 22, 2017
Bump structures, semiconductor device and semiconductor device package having the same
ADVANCED SEMICONDUCTOR ENG0 citations51
US11277917B2Mar 15, 2022
Embedded component package structure, embedded type panel substrate and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations50
SF MOTORS INC
8 patentsUS11228071B2Jan 18, 2022
Battery cell for electric vehicle battery pack
SF MOTORS INC0 citations59
US10930901B2Feb 23, 2021
Electric vehicle battery cell having a patterned surface
SF MOTORS INC0 citations52
US10622604B2Apr 14, 2020
Integrated battery modules in electric vehicles
SF MOTORS INC0 citations51
US10424769B1Sep 24, 2019
Integrated battery cell module
SF MOTORS INC0 citations51
US10734620B2Aug 4, 2020
Battery cell for electric vehicle battery pack
SF MOTORS INC0 citations49
US10756396B2Aug 25, 2020
Battery cells for battery packs in electric vehicles
SF MOTORS INC0 citations42
US10651439B2May 12, 2020
Integrated battery cell modules with plug-in battery cells for electric vehicles
SF MOTORS INC0 citations42
US10573864B2Feb 25, 2020
Battery cells for battery packs in electric vehicles
SF MOTORS INC0 citations40
LO JIAN-WEN
2 patentsUNIV NAT SUN YAT SEN
2 patentsUS7671141B2Mar 2, 2010
Second order nonlinear optical polyimides having benzobisthiazole-based pendant groups, and preparation of the same
UNIV NAT SUN YAT SEN2 citations57
US7670512B2Mar 2, 2010
Second order nonlinear optical polyimides having benzobisthiazole-based pendant groups, and preparation of the same
UNIV NAT SUN YAT SEN0 citations47