Inventor
SEONG MIN-JAE
KR6 patents
Patents
6 patentsUS10950587B2Mar 16, 2021
Printed circuit board and package structure
SAMSUNG ELECTRO MECH7 citations76
US9699885B2Jul 4, 2017
Circuit board including heat dissipation structure
SAMSUNG ELECTRO MECH2 citations72
US9793250B2Oct 17, 2017
Package board, method for manufacturing the same and package on package having the same
SAMSUNG ELECTRO MECH3 citations71
US11382213B2Jul 5, 2022
Printed circuit board
SAMSUNG ELECTRO MECH1 citations59
US10064291B2Aug 28, 2018
Circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations51
US9992865B2Jun 5, 2018
Circuit board and assembly thereof
SAMSUNG ELECTRO MECH0 citations41