Inventor
LIAO HUNG-CHE
TW20 patents
⚠️ This page may combine multiple inventors who share the name “LIAO HUNG-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS9825046B2Nov 21, 2017
Flash memory device having high coupling ratio
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12464714B2Nov 4, 2025
Semiconductor device having non-continuous wall structure surrounding a stacked gate structure including a conductive layer disposed between segmented portions of the wall structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11925017B2Mar 5, 2024
Semiconductor device having a wall structure surrounding a stacked gate structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11594449B2Feb 28, 2023
Method of making a semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11121141B2Sep 14, 2021
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10964589B2Mar 30, 2021
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10283510B2May 7, 2019
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9768182B2Sep 19, 2017
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10535670B2Jan 14, 2020
Non-volatile memory having an erase gate formed between two floating gates with two word lines formed on other sides and a method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9735049B2Aug 15, 2017
Method for fabricating semiconductor structure with passivation sidewall block
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9666588B2May 30, 2017
Damascene non-volatile memory cells and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9082617B2Jul 14, 2015
Integrated circuit and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US10283604B2May 7, 2019
Contact structure for high aspect ratio and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations39
US9449976B2Sep 20, 2016
Semiconductor device structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations36
TAIWAN SEMICONDUCTOR MFG
5 patentsUS6590295B1Jul 8, 2003
Microelectronic device with a spacer redistribution layer via and method of making the same
TAIWAN SEMICONDUCTOR MFG112 citations94
US5923988AJul 13, 1999
Two step thermal treatment procedure applied to polycide structures deposited using dichlorosilane as a reactant
TAIWAN SEMICONDUCTOR MFG14 citations68
US6310397B1Oct 30, 2001
Butted contact resistance of an SRAM by double VCC implantation
TAIWAN SEMICONDUCTOR MFG8 citations65
US6017828AJan 25, 2000
Method for preventing backside polysilicon peeling in a 4T+2R SRAM process
TAIWAN SEMICONDUCTOR MFG2 citations62
US6057186AMay 2, 2000
Method for improving the butted contact resistance of an SRAM by double Vcc implantation
TAIWAN SEMICONDUCTOR MFG4 citations60