Inventor
PELZER RAINER
AT10 patents
⚠️ This page may combine multiple inventors who share the name “PELZER RAINER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS10304782B2May 28, 2019
Compressive interlayer having a defined crack-stop edge extension
INFINEON TECHNOLOGIES AG4 citations69
US11239188B2Feb 1, 2022
Terminal structure of a power semiconductor device
INFINEON TECHNOLOGIES AG1 citations61
US11488921B2Nov 1, 2022
Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect
INFINEON TECHNOLOGIES AG0 citations56
US11031321B2Jun 8, 2021
Semiconductor device having a die pad with a dam-like configuration
INFINEON TECHNOLOGIES AG0 citations48
US10700019B2Jun 30, 2020
Semiconductor device with compressive interlayer
INFINEON TECHNOLOGIES AG0 citations48
US8884407B2Nov 11, 2014
Devices for providing an electrical connection
INFINEON TECHNOLOGIES AG0 citations48
US11127693B2Sep 21, 2021
Barrier for power metallization in semiconductor devices
INFINEON TECHNOLOGIES AG0 citations45
INFINEON TECHNOLOGIES AUSTRIA AG
3 patentsUS11276624B2Mar 15, 2022
Semiconductor device power metallization layer with stress-relieving heat sink structure
INFINEON TECHNOLOGIES AUSTRIA AG0 citations57
US10978395B2Apr 13, 2021
Method of manufacturing a semiconductor device having a power metallization structure
INFINEON TECHNOLOGIES AUSTRIA AG0 citations57
US10734320B2Aug 4, 2020
Power metallization structure for semiconductor devices
INFINEON TECHNOLOGIES AUSTRIA AG0 citations49