Inventor

SHANGGUAN DONGKAI

US35 patents

⚠️ This page may combine multiple inventors who share the name “SHANGGUAN DONGKAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHANGGUAN DONGKAI

FLEX LTD

System in package with double side mounted board

Embedded copper structure for microelectronics package

Connection of multilayer printed conductive ink through filled microvias

Control of thermal interface material in multi-chip package

Methods of creating exposed cavities in molded electronic devices

Methods of creating exposed cavities in molded electronic devices

Stress relief encapsulation for flexible hybrid electronics

Stress relief encapsulation for flexible hybrid electronics

Devices, systems, and methods for stacked die packages

Electronics encapsulation through hotmelt lamination

Electronic encapsulation through stencil printing

Testing system for flexible sample in electronics having a retractable holder configured to conform a sample by a mandrel

Methods, devices, and systems for electronic device molding and encapsulation

FORD MOTOR CO

Electrical solder and method of manufacturing

Aluminum components coated with zinc-antimony alloy for manufacturing assemblies by CAB brazing

Lead-free solder compositions

Lead-free, low-temperature solder compositions

Method of forming interconnections on electronic modules

Flip chip interconnections on electronic modules

Metallic adhesive for forming electronic interconnects at low temperatures

Soldering process with minimal thermal impact on substrate

Low-temperature solder compositions

Low temperature lead-free solder compositions

Lead-free solder alloys

VISTEON GLOBAL TECH INC

Method of forming interconnections on electronic modules

Lead-free electrical solder and method of manufacturing

Conductor systems for thick film electronic circuits

Solder composition and a method for making the same

FLEXTRONICS INT USA INC

Integrated lens and chip assembly for a digital camera

External adjustment mechanism for a camera lens and electronic imager

FLEXTRONICS AP LLC

Wafer based camera module and method of manufacture

SHANGGUAN DONGKAI

Camera module with premolded lens housing and method of manufacture

SINGH HARPUNEET

Wafer level camera module with molded housing and method of manufacturing

KALE VIDYADHAR SITARAM

Integrated lens and chip assembly for a digital camera

NAT CENTER FOR ADVANCED PACKAGING CO LTD

Method of manufacturing fan out wafer level package