Inventor
LIVENGOOD RICHARD H
US28 patents
Patents
28 patentsUS6448168B1Sep 10, 2002
Method for distributing a clock on the silicon backside of an integrated circuit
INTEL CORP382 citations99
US6222246B1Apr 24, 2001
Flip-chip having an on-chip decoupling capacitor
INTEL CORP106 citations98
US6037822AMar 14, 2000
Method and apparatus for distributing a clock on the silicon backside of an integrated circuit
INTEL CORP71 citations96
US6825557B2Nov 30, 2004
Localized backside chip cooling with integrated smart valves
INTEL CORP62 citations95
US6495454B2Dec 17, 2002
Substrate interconnect for power distribution on integrated circuits
INTEL CORP66 citations94
US6355950B1Mar 12, 2002
Substrate interconnect for power distribution on integrated circuits
INTEL CORP47 citations94
US5952247ASep 14, 1999
Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
INTEL CORP34 citations93
US5948217ASep 7, 1999
Method and apparatus for endpointing while milling an integrated circuit
INTEL CORP45 citations93
US5942805AAug 24, 1999
Fiducial for aligning an integrated circuit die
INTEL CORP40 citations93
US5805421ASep 8, 1998
Semiconductor substrate having alignment marks for locating circuitry on the substrate
INTEL CORP30 citations93
US6355494B1Mar 12, 2002
Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing
INTEL CORP27 citations92
US6316981B1Nov 13, 2001
Signal distribution network on backside of substrate
INTEL CORP23 citations92
US6020746AFeb 1, 2000
Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die
INTEL CORP21 citations92
US5976980ANov 2, 1999
Method and apparatus providing a mechanical probe structure in an integrated circuit die
INTEL CORP20 citations92
US5904486AMay 18, 1999
Method for performing a circuit edit through the back side of an integrated circuit die
INTEL CORP17 citations92
US6525922B2Feb 25, 2003
High performance via capacitor and method for manufacturing same
INTEL CORP9 citations74
US6309897B1Oct 30, 2001
Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die
INTEL CORP10 citations74
US6159753ADec 12, 2000
Method and apparatus for editing an integrated circuit
INTEL CORP9 citations74
US6153891ANov 28, 2000
Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die
INTEL CORP10 citations74
US6150718ANov 21, 2000
Method and apparatus for performing a circuit edit through the back side of an integrated circuit die
INTEL CORP12 citations74
US6122174ASep 19, 2000
Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
INTEL CORP6 citations74
US6001703ADec 14, 1999
Method of forming a fiducial for aligning an integrated circuit die
INTEL CORP12 citations74
US7232526B2Jun 19, 2007
Method and apparatus for controlling material removal from semiconductor substrate using induced current endpointing
INTEL CORP4 citations73
US6579732B2Jun 17, 2003
Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing
INTEL CORP5 citations73
US7205566B2Apr 17, 2007
Transistor-level signal cutting method and structure
INTEL CORP2 citations61
US7141439B2Nov 28, 2006
Transistor-level signal cutting method and structure
INTEL CORP0 citations51
US6780658B2Aug 24, 2004
Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing
INTEL CORP0 citations51
US7183122B2Feb 27, 2007
Physical nano-machining with a scanning probe system for integrated circuit modification
INTEL CORP0 citations42