Inventor
HUEBNER HOLGER
DE22 patents
⚠️ This page may combine multiple inventors who share the name “HUEBNER HOLGER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SIEMENS AG
13 patentsUS5902118AMay 11, 1999
Method for production of a three-dimensional circuit arrangement
SIEMENS AG160 citations98
US5419806AMay 30, 1995
Method for manufacturing a three-dimensional circuit apparatus
SIEMENS AG118 citations97
US5930596AJul 27, 1999
Semiconductor component for vertical integration and manufacturing method
SIEMENS AG54 citations96
US4980316ADec 25, 1990
Method for producing a resist structure on a semiconductor
SIEMENS AG63 citations96
US5901901AMay 11, 1999
Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly
SIEMENS AG28 citations92
US5706578AJan 13, 1998
Method for producing a three-dimensional circuit arrangement
SIEMENS AG29 citations92
US5474651ADec 12, 1995
Method for filling via holes in a semiconductor layer structure
SIEMENS AG20 citations92
US4950377AAug 21, 1990
Apparatus and method for reactive ion etching
SIEMENS AG26 citations92
US5969534AOct 19, 1999
Semiconductor testing apparatus
SIEMENS AG13 citations74
US6597053B1Jul 22, 2003
Integrated circuit arrangement with a number of structural elements and method for the production thereof
SIEMENS AG12 citations72
US5943563AAug 24, 1999
Method for producing a three-dimensional circuit arrangement
SIEMENS AG6 citations62
US5830803ANov 3, 1998
Method for filling contact holes using a doctor blade
SIEMENS AG0 citations52
US5610531AMar 11, 1997
Testing method for semiconductor circuit levels
SIEMENS AG0 citations42
INFINEON TECHNOLOGIES AG
7 patentsUS6872464B2Mar 29, 2005
Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent
INFINEON TECHNOLOGIES AG32 citations92
US6268659B1Jul 31, 2001
Semiconductor body with layer of solder material comprising chromium
INFINEON TECHNOLOGIES AG11 citations74
US6906370B1Jun 14, 2005
Semiconductor component having a material reinforced contact area
INFINEON TECHNOLOGIES AG5 citations63
US6915945B2Jul 12, 2005
Method for contact-connecting an electrical component to a substrate having a conductor structure
INFINEON TECHNOLOGIES AG6 citations62
US6773956B2Aug 10, 2004
Method for contact-connecting a semiconductor component
INFINEON TECHNOLOGIES AG2 citations62
US6709949B2Mar 23, 2004
Method for aligning structures on a semiconductor substrate
INFINEON TECHNOLOGIES AG5 citations62
US6930383B2Aug 16, 2005
Electronic component including a housing and a substrate
INFINEON TECHNOLOGIES AG3 citations56