Inventor

MEIKLE SCOTT

US38 patents

⚠️ This page may combine multiple inventors who share the name “MEIKLE SCOTT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEIKLE SCOTT

MICRON TECHNOLOGY INC

Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives

Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives

Method and apparatus for uniformly planarizing a microelectronic substrate

Under-pad for chemical-mechanical planarization of semiconductor wafers

Under-pad for chemical-mechanical planarization of semiconductor wafers

Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes

Method of depositing tungsten nitride using a source gas comprising silicon

Optical end point detection methods in semiconductor planarizing polishing processes

Planarization fluid composition including chelating agents

Planarization fluid composition chelating agents and planarization method using same

Method of chimical mechanical polishing for dielectric layers

Electro-mechanically polished structure

Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning

Electro-mechanical polishing of platinum container structure

Barrier materials for semiconductor devices

Method of depositing tungsten nitride using a source gas comprising silicon

Method of depositing tungsten nitride using a source gas comprising silicon

Method and apparatus for uniformly planarizing a microelectronic substrate

Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives

Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives

Method and apparatus for uniformly planarizing a microelectronic substrate

Planarization method using fluid composition including chelating agents

Method for reducing the heights of interconnects on a projecting region with a smaller reduction in the heights of other interconnects

Method of depositing tungsten nitride using a source gas comprising silicon

Planarization process with abrasive polishing slurry that is selective to a planarized surface

Planarization method using fluid composition including chelating agents

Semiconductor structure having interconnects on a projecting region and substrate

Stud capacitor device and fabrication method

Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning

Method and apparatus for uniformly planarizing a microelectronic substrate

Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives

Method and apparatus for uniformly planarizing a microelectronic substrate

Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives

MICRON SEMICONDUCTOR INC

Method for shaping features of a semiconductor structure using chemical mechanical planarization (CMP)

Chemical-mechanical polishing processes of planarizing insulating layers

(unassigned)

Planarization process with abrasive polishing slurry that is selective to a planarized surface

CHOPRA DINESH

Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning

BLALOCK GUY

Stud capacitor device and fabrication method