Inventor
WANG HSING SENG
TW10 patents
Patents
10 patentsUS5736785AApr 7, 1998
Semiconductor package for improving the capability of spreading heat
IND TECH RES INST192 citations98
US6590282B1Jul 8, 2003
Stacked semiconductor package formed on a substrate and method for fabrication
IND TECH RES INST145 citations97
US6207475B1Mar 27, 2001
Method for dispensing underfill and devices formed
IND TECH RES INST128 citations97
US5977626ANov 2, 1999
Thermally and electrically enhanced PBGA package
IND TECH RES INST426 citations96
US6479321B2Nov 12, 2002
One-step semiconductor stack packaging method
IND TECH RES INST38 citations92
US6255140B1Jul 3, 2001
Flip chip chip-scale package
IND TECH RES INST50 citations92
US5783860AJul 21, 1998
Heat sink bonded to a die paddle having at least one aperture
IND TECH RES INST34 citations91
US6536653B2Mar 25, 2003
One-step bumping/bonding method for forming semiconductor packages
IND TECH RES INST21 citations89
US5789270AAug 4, 1998
Method for assembling a heat sink to a die paddle
IND TECH RES INST12 citations72
US5672547ASep 30, 1997
Method for bonding a heat sink to a die paddle
IND TECH RES INST9 citations72