Inventor
ENDO MITSUYOSHI
JP24 patents
⚠️ This page may combine multiple inventors who share the name “ENDO MITSUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
17 patentsUS4770953ASep 13, 1988
Aluminum nitride sintered body having conductive metallized layer
TOSHIBA KK87 citations96
US7370412B2May 13, 2008
Method for connecting electronic device
TOSHIBA KK21 citations92
US7095112B2Aug 22, 2006
Semiconductor device, semiconductor package member, and semiconductor device manufacturing method
TOSHIBA KK20 citations92
US5280850AJan 25, 1994
Method of manufacturing circuit board
TOSHIBA KK24 citations92
US5176309AJan 5, 1993
Method of manufacturing circuit board
TOSHIBA KK31 citations92
US7768456B2Aug 3, 2010
Antenna device and radio communication device
TOSHIBA KK11 citations83
US9543484B1Jan 10, 2017
Semiconductor light emitting device and method for manufacturing same
TOSHIBA KK12 citations82
US9755127B2Sep 5, 2017
Semiconductor light emitting device and method for manufacturing same
TOSHIBA KK4 citations72
US9209097B2Dec 8, 2015
Substrate bonding method and substrate bonding apparatus
TOSHIBA KK2 citations62
US6861738B2Mar 1, 2005
Laminated-chip semiconductor device
TOSHIBA KK3 citations62
US6617678B2Sep 9, 2003
Semiconductor device
TOSHIBA KK6 citations62
US9735325B2Aug 15, 2017
Semiconductor device and manufacturing method of semiconductor device
TOSHIBA KK0 citations52
US9312207B2Apr 12, 2016
Semiconductor device
TOSHIBA KK1 citations51
US9123717B2Sep 1, 2015
Semiconductor device manufacturing method and manufacturing apparatus
TOSHIBA KK0 citations51
US9887328B2Feb 6, 2018
Semiconductor light emitting device and method for manufacturing same
TOSHIBA KK0 citations41
US9229052B2Jan 5, 2016
Stack including inspection circuit, inspection method and inspection apparatus
TOSHIBA KK0 citations41
US9595631B2Mar 14, 2017
Semiconductor light emitting device and method of manufacturing the same
TOSHIBA KK0 citations40
ENDO MITSUYOSHI
4 patentsUS8884396B2Nov 11, 2014
Semiconductor device and manufacturing method thereof
ENDO MITSUYOSHI4 citations71
US8766407B2Jul 1, 2014
Semiconductor wafer and laminate structure including the same
ENDO MITSUYOSHI2 citations61
US8427808B2Apr 23, 2013
Variable capacity element
ENDO MITSUYOSHI0 citations50
US8324715B2Dec 4, 2012
Semiconductor device and method of manufacturing the same
ENDO MITSUYOSHI1 citations50
TOKYO SHIBAURA ELECTRIC CO
2 patentsUS5703397ADec 30, 1997
Semiconductor package having an aluminum nitride substrate
TOKYO SHIBAURA ELECTRIC CO60 citations95
US5969413AOct 19, 1999
Semiconductor device having a tab chip on a tape carrier with lead wirings provided on the tape carrier used as external leads
TOKYO SHIBAURA ELECTRIC CO14 citations71