Inventor
INGRAHAM ANTHONY P
US16 patents
Patents
16 patentsUS5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US5926369AJul 20, 1999
Vertically integrated multi-chip circuit package with heat-sink support
IBM182 citations97
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US6121069ASep 19, 2000
Interconnect structure for joining a chip to a circuit card
IBM66 citations96
US6061245AMay 9, 2000
Free standing, three dimensional, multi-chip, carrier package with air flow baffle
IBM91 citations96
US5391514AFeb 21, 1995
Low temperature ternary C4 flip chip bonding method
IBM79 citations96
US6094059AJul 25, 2000
Apparatus and method for burn-in/testing of integrated circuit devices
IBM39 citations95
US6094060AJul 25, 2000
Test head for applying signals in a burn-in test of an integrated circuit
IBM44 citations95
US6075287AJun 13, 2000
Integrated, multi-chip, thermally conductive packaging device and methodology
IBM70 citations95
US5949246ASep 7, 1999
Test head for applying signals in a burn-in test of an integrated circuit
IBM65 citations95
US5528159AJun 18, 1996
Method and apparatus for testing integrated circuit chips
IBM63 citations94
US5420520AMay 30, 1995
Method and apparatus for testing of integrated circuit chips
IBM128 citations94
US5523696AJun 4, 1996
Method and apparatus for testing integrated circuit chips
IBM64 citations93
US5953623ASep 14, 1999
Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection
IBM43 citations92
US6256203B1Jul 3, 2001
Free standing, three dimensional, multi-chip, carrier package with air flow baffle
IBM22 citations91
US6137299AOct 24, 2000
Method and apparatus for testing integrated circuit chips
IBM41 citations89