Inventor
KAMPERMAN JAMES STEVEN
US8 patents
Patents
8 patentsUS6094060AJul 25, 2000
Test head for applying signals in a burn-in test of an integrated circuit
IBM44 citations95
US6094059AJul 25, 2000
Apparatus and method for burn-in/testing of integrated circuit devices
IBM39 citations95
US5949246ASep 7, 1999
Test head for applying signals in a burn-in test of an integrated circuit
IBM65 citations95
US6156484ADec 5, 2000
Gray scale etching for thin flexible interposer
IBM78 citations94
US5734560AMar 31, 1998
Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap
IBM54 citations94
US6098280AAug 8, 2000
Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes
IBM8 citations72
US5773195AJun 30, 1998
Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
IBM9 citations72
US6594891B1Jul 22, 2003
Process for forming multi-layer electronic structures
IBM3 citations61