Inventor

FUKUTOMI NAOKI

JP17 patents

⚠️ This page may combine multiple inventors who share the name “FUKUTOMI NAOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUKUTOMI NAOKI

HITACHI CHEMICAL CO LTD

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device

Wiring board for electrical tests with bumps having polymeric coating

Process for producing printed wiring boards

Fabrication process of wiring board

Process for the fabrication of wiring board for electrical tests

Semiconductor device and method of fabrication thereof

Fabrication process of wiring board

Fabrication process of wiring board

Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board

Process for producing high-density wiring board

Method of producing a multistylus head device

Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package

High-density wired circuit board using insulated wires

(unassigned)

Fabrication process of semiconductor package and semiconductor package