Inventor

EGITTO FRANK D

US74 patents

⚠️ This page may combine multiple inventors who share the name “EGITTO FRANK D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EGITTO FRANK D

IBM

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Membrane probe with anchored elements

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Method for bonding heat sinks to overmolds and device formed thereby

Method of forming a flip chip assembly

Laser excision of laminate chip carriers

Fluxless joining process for enriched solders

Multilayered laminate

Flip chip assembly

Method of forming a flip chip assembly, and a flip chip assembly formed by the method

Method of forming adherent metal components on a polyimide substrate

Method of forming adherent metal components on a polyimide substrate

Method of forming filled blind vias

Membrane probe with anchored elements

Fabrication of a metalized blind via

Removal of excimer laser debris using carbon dioxide laser

Method of making a circuitized substrate

Design of high density structures with laser etch stop

Process for removing contaminant

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Method for bonding heat sinks to overmolds and device formed thereby

Method for bonding heat sinks to overmolds and device formed thereby

Method of forming a via in a substrate

Method and structure for small pitch z-axis electrical interconnections

Method and structure for small pitch z-axis electrical interconnections

Design of high density structures with laser etch stop

Enhanced plasma etching

Electronic package with filled blinds vias

Fabrication of a metalized blind via

Process for chemically and mechanically enhancing solder surface properties

Electronic package including lower water content polyimide film

Method of drilling vias and through holes

Method for selectively etching the materials of a composite of two materials

Multi-layered interconnect structure using liquid crystalline polymer dielectric

ENDICOTT INTERCONNECT TECH INC

Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

Interposer for use with test apparatus

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Interposer and test assembly for testing electronic devices

Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same

Method of making an interposer

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

Circuitized substrate and method of making same

Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same

APPLIED MATERIALS INC

Materials and methods for plasma etching of aluminum and aluminum alloys

Materials and methods for plasma etching of oxides and nitrides of silicon

DAS RABINDRA N

Substrate having internal capacitor and method of making same

Method of forming multilayer capacitors in a printed circuit substrate

MARKOVICH VOYA R

Electronic package with thermal interposer and method of making same

EGITTO FRANK D

Method of making circuitized substrates having film resistors as part thereof

ANTESBERGER TIMOTHY

Electronic package including high density interposer and circuitized substrate assembly utilizing same