Inventor
FEY EDMOND O
US12 patents
Patents
12 patentsUS6586683B2Jul 1, 2003
Printed circuit board with mixed metallurgy pads and method of fabrication
IBM15 citations91
US4444626AApr 24, 1984
Electrochromic printing
IBM32 citations90
US4358479ANov 9, 1982
Treatment of copper and use thereof
IBM20 citations81
US6931722B2Aug 23, 2005
Method of fabricating printed circuit board with mixed metallurgy pads
IBM7 citations72
US6335495B1Jan 1, 2002
Patterning a layered chrome-copper structure disposed on a dielectric substrate
IBM11 citations72
US6056831AMay 2, 2000
Process for chemically and mechanically enhancing solder surface properties
IBM13 citations72
US5311660AMay 17, 1994
Methyl chloroform-free desmear process in additive circuitization
IBM17 citations70
US4684545AAug 4, 1987
Electroless plating with bi-level control of dissolved oxygen
IBM14 citations70
US6843929B1Jan 18, 2005
Accelerated etching of chromium
IBM3 citations61
US6607613B2Aug 19, 2003
Solder ball with chemically and mechanically enhanced surface properties
IBM5 citations61
US4967690ANov 6, 1990
Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
IBM3 citations59
US6210547B1Apr 3, 2001
Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties
IBM0 citations51