Inventor
MATIENZO LUIS J
US41 patents
⚠️ This page may combine multiple inventors who share the name “MATIENZO LUIS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
36 patentsUS6104093AAug 15, 2000
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM92 citations97
US6410988B1Jun 25, 2002
Thermally enhanced and mechanically balanced flip chip package and method of forming
IBM45 citations96
US6206997B1Mar 27, 2001
Method for bonding heat sinks to overmolds and device formed thereby
IBM36 citations96
US6074895AJun 13, 2000
Method of forming a flip chip assembly
IBM63 citations95
US5372848ADec 13, 1994
Process for creating organic polymeric substrate with copper
IBM74 citations95
US6250540B1Jun 26, 2001
Fluxless joining process for enriched solders
IBM23 citations93
US6596559B2Jul 22, 2003
Flip-chip package with optimized encapsulant adhesion and method
IBM17 citations92
US6348738B1Feb 19, 2002
Flip chip assembly
IBM17 citations92
US6306683B1Oct 23, 2001
Method of forming a flip chip assembly, and a flip chip assembly formed by the method
IBM16 citations92
US6284329B1Sep 4, 2001
Method of forming adherent metal components on a polyimide substrate
IBM20 citations92
US6194076B1Feb 27, 2001
Method of forming adherent metal components on a polyimide substrate
IBM19 citations92
US6522014B1Feb 18, 2003
Fabrication of a metalized blind via
IBM23 citations91
US6210781B1Apr 3, 2001
Method for photoselective seeding and metallization of three-dimensional materials
IBM18 citations91
US6022596AFeb 8, 2000
Method for photoselective seeding and metallization of three-dimensional materials
IBM17 citations91
US5532024AJul 2, 1996
Method for improving the adhesion of polymeric adhesives to nickel surfaces
IBM36 citations90
US6017613AJan 25, 2000
Method for photoselective seeding and metallization of three-dimensional materials
IBM11 citations81
US6719871B2Apr 13, 2004
Method for bonding heat sinks to overmolds and device formed thereby
IBM10 citations74
US6576996B2Jun 10, 2003
Method for bonding heat sinks to overmolds and device formed thereby
IBM8 citations74
US6713858B2Mar 30, 2004
Flip-chip package with optimized encapsulant adhesion and method
IBM5 citations73
US6248614B1Jun 19, 2001
Flip-chip package with optimized encapsulant adhesion and method
IBM9 citations73
US6136513AOct 24, 2000
Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
IBM12 citations73
US6693031B2Feb 17, 2004
Formation of a metallic interlocking structure
IBM7 citations72
US6576549B2Jun 10, 2003
Fabrication of a metalized blind via
IBM5 citations72
US6348737B1Feb 19, 2002
Metallic interlocking structure
IBM8 citations72
US6252307B1Jun 26, 2001
Structure for preventing adhesive bleed onto surfaces
IBM12 citations72
US6056831AMay 2, 2000
Process for chemically and mechanically enhancing solder surface properties
IBM13 citations72
US5461203AOct 24, 1995
Electronic package including lower water content polyimide film
IBM10 citations72
US6770968B2Aug 3, 2004
Method for bonding heat sinks to overmolds and device formed thereby
IBM2 citations63
US6656313B2Dec 2, 2003
Structure and method for improved adhesion between two polymer films
IBM3 citations63
US6447914B1Sep 10, 2002
Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
IBM3 citations62
US6607613B2Aug 19, 2003
Solder ball with chemically and mechanically enhanced surface properties
IBM5 citations61
US6420253B2Jul 16, 2002
Method for preventing adhesive bleed onto surfaces
IBM3 citations61
US7309529B2Dec 18, 2007
Structure and method for improved adhesion between two polymer films
IBM0 citations52
US7067193B2Jun 27, 2006
Structure and method for improved adhesion between two polymer films
IBM0 citations52
US6210547B1Apr 3, 2001
Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties
IBM0 citations51
US7763188B2Jul 27, 2010
Electrically stable copper filled electrically conductive adhesive
IBM0 citations48
ENDICOTT INTERCONNECT TECH INC
4 patentsUS7342183B2Mar 11, 2008
Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC7 citations74
US7823274B2Nov 2, 2010
Method of making multilayered circuitized substrate assembly
ENDICOTT INTERCONNECT TECH INC4 citations63
US7334323B2Feb 26, 2008
Method of making mutilayered circuitized substrate assembly having sintered paste connections
ENDICOTT INTERCONNECT TECH INC4 citations63
US7307022B2Dec 11, 2007
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof
ENDICOTT INTERCONNECT TECH INC1 citations51