Inventor
RAI RAJINDER S
US7 patents
⚠️ This page may combine multiple inventors who share the name “RAI RAJINDER S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS6492600B1Dec 10, 2002
Laminate having plated microvia interconnects and method for forming the same
IBM28 citations91
US6056831AMay 2, 2000
Process for chemically and mechanically enhancing solder surface properties
IBM13 citations72
US7328506B2Feb 12, 2008
Method for forming a plated microvia interconnect
IBM2 citations61
US6607613B2Aug 19, 2003
Solder ball with chemically and mechanically enhanced surface properties
IBM5 citations61
US6210547B1Apr 3, 2001
Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties
IBM0 citations51