Inventor
NAGARAJAN KUMAR
US28 patents
⚠️ This page may combine multiple inventors who share the name “NAGARAJAN KUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
11 patentsUS6133064AOct 17, 2000
Flip chip ball grid array package with laminated substrate
LSI LOGIC CORP72 citations96
US6519844B1Feb 18, 2003
Overmold integrated circuit package
LSI LOGIC CORP36 citations92
US6441499B1Aug 27, 2002
Thin form factor flip chip ball grid array
LSI LOGIC CORP33 citations92
US6320127B1Nov 20, 2001
Method and structure for reducing the incidence of voiding in an underfill layer of an electronic component package
LSI LOGIC CORP21 citations92
US6639321B1Oct 28, 2003
Balanced coefficient of thermal expansion for flip chip ball grid array
LSI LOGIC CORP13 citations83
US6963129B1Nov 8, 2005
Multi-chip package having a contiguous heat spreader assembly
LSI LOGIC CORP8 citations72
US6911736B2Jun 28, 2005
Electrostatic discharge protection
LSI LOGIC CORP5 citations63
US6943446B2Sep 13, 2005
Via construction for structural support
LSI LOGIC CORP4 citations62
US7190082B2Mar 13, 2007
Low stress flip-chip package for low-K silicon technology
LSI LOGIC CORP5 citations61
US6806119B2Oct 19, 2004
Method of balanced coefficient of thermal expansion for flip chip ball grid array
LSI LOGIC CORP2 citations61
US6825066B2Nov 30, 2004
Stiffener design
LSI LOGIC CORP1 citations51
MAXIM INTEGRATED PRODUCTS
6 patentsUS9136258B1Sep 15, 2015
Stacked LED for optical sensor devices
MAXIM INTEGRATED PRODUCTS19 citations90
US9354111B2May 31, 2016
Wafer level lens in package
MAXIM INTEGRATED PRODUCTS5 citations72
US9397027B1Jul 19, 2016
Sacrificial pad on semiconductor package device and method
MAXIM INTEGRATED PRODUCTS5 citations68
US9443815B2Sep 13, 2016
Embedded die redistribution layers for active device
MAXIM INTEGRATED PRODUCTS2 citations59
US9627573B2Apr 18, 2017
Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrate
MAXIM INTEGRATED PRODUCTS1 citations50
US10461066B2Oct 29, 2019
Structure and method for hybrid optical package with glass top cover
MAXIM INTEGRATED PRODUCTS0 citations40
XILINX INC
3 patentsUS7187077B1Mar 6, 2007
Integrated circuit having a lid and method of employing a lid on an integrated circuit
XILINX INC17 citations92
US7791192B1Sep 7, 2010
Circuit for and method of implementing a capacitor in an integrated circuit
XILINX INC25 citations91
US7473583B1Jan 6, 2009
Integrated circuit having a lid and method of employing a lid on an integrated circuit
XILINX INC3 citations63