Inventor
NOMURA TORU
JP19 patents
⚠️ This page may combine multiple inventors who share the name “NOMURA TORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
14 patentsUS6710430B2Mar 23, 2004
Resin-encapsulated semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD85 citations97
US6674154B2Jan 6, 2004
Lead frame with multiple rows of external terminals
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD104 citations97
US6498393B2Dec 24, 2002
Semiconductor device and method for the fabrication thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD44 citations96
US7026192B2Apr 11, 2006
Terminal land frame and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6909168B2Jun 21, 2005
Resin encapsulation semiconductor device utilizing grooved leads and die pad
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations92
US6692991B2Feb 17, 2004
Resin-encapsulated semiconductor device and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6680524B2Jan 20, 2004
Semiconductor device and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations92
US6680220B2Jan 20, 2004
Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD32 citations92
US6667541B1Dec 23, 2003
Terminal land frame and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US5321249AJun 14, 1994
Solid-state imaging device and method of manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations92
US5336367AAug 9, 1994
Solid-state imaging device and method of manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations73
US7338838B2Mar 4, 2008
Resin-encapsulation semiconductor device and method for fabricating the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63
US7309624B2Dec 18, 2007
Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations62
US7125751B2Oct 24, 2006
Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62
MATSUSHITA ELECTRONICS CORP
3 patentsUS6225146B1May 1, 2001
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
MATSUSHITA ELECTRONICS CORP247 citations99
US5977615ANov 2, 1999
Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device
MATSUSHITA ELECTRONICS CORP159 citations99
US5708295AJan 13, 1998
Lead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the same
MATSUSHITA ELECTRONICS CORP10 citations74