P

Inventor

NOMURA TORU

JP19 patents
⚠️ This page may combine multiple inventors who share the name “NOMURA TORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

14 patents
US6710430B2Mar 23, 2004

Resin-encapsulated semiconductor device and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD85 citations97
US6674154B2Jan 6, 2004

Lead frame with multiple rows of external terminals

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD104 citations97
US6498393B2Dec 24, 2002

Semiconductor device and method for the fabrication thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD44 citations96
US7026192B2Apr 11, 2006

Terminal land frame and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6909168B2Jun 21, 2005

Resin encapsulation semiconductor device utilizing grooved leads and die pad

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations92
US6692991B2Feb 17, 2004

Resin-encapsulated semiconductor device and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US6680524B2Jan 20, 2004

Semiconductor device and method for fabricating the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations92
US6680220B2Jan 20, 2004

Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD32 citations92
US6667541B1Dec 23, 2003

Terminal land frame and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations92
US5321249AJun 14, 1994

Solid-state imaging device and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations92
US5336367AAug 9, 1994

Solid-state imaging device and method of manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations73
US7338838B2Mar 4, 2008

Resin-encapsulation semiconductor device and method for fabricating the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63
US7309624B2Dec 18, 2007

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations62
US7125751B2Oct 24, 2006

Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62

MATSUSHITA ELECTRONICS CORP

3 patents

FIGARO ENG

1 patent

NARISHIGE LIFEMED CO LTD

1 patent