Inventor
KANEDA YUTAKA
JP24 patents
⚠️ This page may combine multiple inventors who share the name “KANEDA YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON TELEGRAPH & TELEPHONE
9 patentsUS4536887AAug 20, 1985
Microphone-array apparatus and method for extracting desired signal
NIPPON TELEGRAPH & TELEPHONE148 citations97
US5539731AJul 23, 1996
Echo cancelling method and apparatus using fast projection scheme
NIPPON TELEGRAPH & TELEPHONE76 citations96
US5208864AMay 4, 1993
Method of detecting acoustic signal
NIPPON TELEGRAPH & TELEPHONE99 citations96
US5187692AFeb 16, 1993
Acoustic transfer function simulating method and simulator using the same
NIPPON TELEGRAPH & TELEPHONE73 citations96
US5774562AJun 30, 1998
Method and apparatus for dereverberation
NIPPON TELEGRAPH & TELEPHONE76 citations95
US6553122B1Apr 22, 2003
Method and apparatus for multi-channel acoustic echo cancellation and recording medium with the method recorded thereon
NIPPON TELEGRAPH & TELEPHONE22 citations92
US4683590AJul 28, 1987
Inverse control system
NIPPON TELEGRAPH & TELEPHONE48 citations92
US5408530AApr 18, 1995
Echo cancelling method and echo canceller using the same
NIPPON TELEGRAPH & TELEPHONE17 citations74
US5602765AFeb 11, 1997
Adaptive transfer function estimating method and estimating device using the same
NIPPON TELEGRAPH & TELEPHONE12 citations73
SONY CHEMICALS CORP
8 patentsUS6294316B1Sep 25, 2001
Processes for manufacturing flexible printed wiring boards
SONY CHEMICALS CORP22 citations92
US6930390B2Aug 16, 2005
Flexible printed wiring boards
SONY CHEMICALS CORP13 citations83
US6312614B1Nov 6, 2001
Method for production of interposer for mounting semiconductor element
SONY CHEMICALS CORP19 citations77
US6800816B2Oct 5, 2004
Wiring circuit board having bumps and method of producing same
SONY CHEMICALS CORP6 citations74
US6562250B1May 13, 2003
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
SONY CHEMICALS CORP10 citations72
US7076868B2Jul 18, 2006
Wiring circuit board having bumps and method of producing same
SONY CHEMICALS CORP2 citations63
US6518510B2Feb 11, 2003
Bump-attached wiring circuit board and method for manufacturing same
SONY CHEMICALS CORP3 citations62
US6977349B2Dec 20, 2005
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
SONY CHEMICALS CORP0 citations51
KANEKA CORP
3 patentsUS7407694B2Aug 5, 2008
Block copolymer
KANEKA CORP10 citations80
US7309736B2Dec 18, 2007
Acrylic block copolymer and thermoplastic resin composition
KANEKA CORP8 citations71
US12049545B2Jul 30, 2024
Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material
KANEKA CORP0 citations51