Inventor
NAITO KEIICHI
JP10 patents
⚠️ This page may combine multiple inventors who share the name “NAITO KEIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
6 patentsUS4158725AJun 19, 1979
Method of manufacturing an adhesive
SONY CORP12 citations73
US4033840AJul 5, 1977
Thermosetting acryloyloxy-terminate butadiene polymers
SONY CORP16 citations69
US4027063AMay 31, 1977
Flame retardant thermosetting resin
SONY CORP8 citations69
US7520053B2Apr 21, 2009
Method for manufacturing a bump-attached wiring circuit board
SONY CORP2 citations62
US7020961B2Apr 4, 2006
Method for manufacturing a bump-attached wiring circuit board
SONY CORP1 citations62
US4323659AApr 6, 1982
Non-flammable adhesive compositions
SONY CORP5 citations58
SONY CHEMICALS CORP
3 patentsUS6562250B1May 13, 2003
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
SONY CHEMICALS CORP10 citations72
US6518510B2Feb 11, 2003
Bump-attached wiring circuit board and method for manufacturing same
SONY CHEMICALS CORP3 citations62
US6977349B2Dec 20, 2005
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
SONY CHEMICALS CORP0 citations51