Inventor
SHINOHARA TOSHIHIRO
JP11 patents
⚠️ This page may combine multiple inventors who share the name “SHINOHARA TOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CHEMICALS CORP
7 patentsUS6596947B1Jul 22, 2003
Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
SONY CHEMICALS CORP22 citations91
US6912779B2Jul 5, 2005
Method of manufacturing flexible wiring board
SONY CHEMICALS CORP14 citations80
US6562250B1May 13, 2003
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
SONY CHEMICALS CORP10 citations72
US6437251B1Aug 20, 2002
Flexible board made by joining two pieces through an adhesive film
SONY CHEMICALS CORP9 citations72
US6518510B2Feb 11, 2003
Bump-attached wiring circuit board and method for manufacturing same
SONY CHEMICALS CORP3 citations62
US6840430B2Jan 11, 2005
Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards
SONY CHEMICALS CORP5 citations61
US6977349B2Dec 20, 2005
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
SONY CHEMICALS CORP0 citations51
SONY CORP
3 patentsUS7520053B2Apr 21, 2009
Method for manufacturing a bump-attached wiring circuit board
SONY CORP2 citations62
US7020961B2Apr 4, 2006
Method for manufacturing a bump-attached wiring circuit board
SONY CORP1 citations62
US7098132B2Aug 29, 2006
Method of manufacturing flexible wiring board
SONY CORP0 citations48