Inventor
SIEW YONG KONG
MY19 patents
⚠️ This page may combine multiple inventors who share the name “SIEW YONG KONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
8 patentsUS6406975B1Jun 18, 2002
Method for fabricating an air gap shallow trench isolation (STI) structure
CHARTERED SEMICONDUCTOR MFG84 citations97
US6380106B1Apr 30, 2002
Method for fabricating an air gap metallization scheme that reduces inter-metal capacitance of interconnect structures
CHARTERED SEMICONDUCTOR MFG84 citations97
US7524755B2Apr 28, 2009
Entire encapsulation of Cu interconnects using self-aligned CuSiN film
CHARTERED SEMICONDUCTOR MFG37 citations91
US7247555B2Jul 24, 2007
Method to control dual damascene trench etch profile and trench depth uniformity
CHARTERED SEMICONDUCTOR MFG13 citations84
US7833900B2Nov 16, 2010
Interconnections for integrated circuits including reducing an overburden and annealing
CHARTERED SEMICONDUCTOR MFG2 citations62
US7670946B2Mar 2, 2010
Methods to eliminate contact plug sidewall slit
CHARTERED SEMICONDUCTOR MFG4 citations61
US6121135ASep 19, 2000
Modified buried contact process for IC device fabrication
CHARTERED SEMICONDUCTOR MFG1 citations52
US7947604B2May 24, 2011
Method for corrosion prevention during planarization
CHARTERED SEMICONDUCTOR MFG0 citations51
SAMSUNG ELECTRONICS CO LTD
8 patentsUS10396034B2Aug 27, 2019
Semiconductor devices and methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations83
US9865594B2Jan 9, 2018
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD2 citations73
US11335637B2May 17, 2022
Semiconductor devices and methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations72
US9997402B2Jun 12, 2018
Method of manufacturing a wiring structure on a self-forming barrier pattern
SAMSUNG ELECTRONICS CO LTD3 citations72
US9793158B2Oct 17, 2017
Methods of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US12132001B2Oct 29, 2024
Semiconductor devices and methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US11804438B2Oct 31, 2023
Semiconductor devices and methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US10079147B2Sep 18, 2018
Method of forming interconnects for semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations48