P

Inventor

PARK JUN-HEYOUNG

KR12 patents
⚠️ This page may combine multiple inventors who share the name “PARK JUN-HEYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

5 patents
US7653991B2Feb 2, 2010

Method for manufacturing printed circuit board having embedded component

SAMSUNG ELECTRO MECH22 citations92
US7794820B2Sep 14, 2010

Printed circuit board and fabricating method of the same

SAMSUNG ELECTRO MECH8 citations82
US7836590B2Nov 23, 2010

Manufacturing method for printed circuit board

SAMSUNG ELECTRO MECH5 citations62
US8377748B2Feb 19, 2013

Method of manufacturing cooling fin and package substrate with cooling fin

SAMSUNG ELECTRO MECH2 citations61
US7841074B2Nov 30, 2010

Method of fabricating paste bump for printed circuit board

SAMSUNG ELECTRO MECH0 citations41

SAMSUNG ELECTRONICS CO LTD

2 patents
US10790255B2Sep 29, 2020

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations71
US10847474B2Nov 24, 2020

Semiconductor package and electromagnetic interference shielding structure for the same

SAMSUNG ELECTRONICS CO LTD1 citations61

MOK JEE-SOO

1 patent
US8058558B2Nov 15, 2011

Printed circuit board and manufacturing method thereof

MOK JEE-SOO42 citations90

MOK JEE SOO

1 patent
US8161634B2Apr 24, 2012

Method of fabricating a printed circuit board

MOK JEE SOO3 citations61

KIM DONG SUN

1 patent
US8065798B2Nov 29, 2011

Method of manufacturing printed circuit board

KIM DONG SUN2 citations60

PARK JUN-HEYOUNG

1 patent
US8222534B2Jul 17, 2012

Printed circuit board and manufacturing method thereof

PARK JUN-HEYOUNG3 citations56

HWANG JUN-OH

1 patent
US8166647B2May 1, 2012

Method of manufacturing a printed circuit board

HWANG JUN-OH0 citations43