Inventor

TU WEN-CHIANG

US39 patents

⚠️ This page may combine multiple inventors who share the name “TU WEN-CHIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TU WEN-CHIANG

APPLIED MATERIALS INC

Method and apparatus for forming metal interconnects

Determination of gain for eddy current sensor

Post-etch treatment of plasma-etched feature surfaces to prevent corrosion

Using optical metrology for within wafer feed forward process control

Method and composition for polishing a substrate

Robot blade for handling of semiconductor substrates

Robot blade for handling of semiconductor substrate

Adjusting eddy current measurements

In-situ monitoring system with monitoring of elongated region

Monitoring retaining ring thickness and pressure control

Inductive monitoring of conductive trench depth

Determination of gain for eddy current sensor

Inductive monitoring of conductive trench depth

Substrate features for inductive monitoring of conductive trench depth

Feedback control using detection of clearance and adjustment for uniform topography

X-ray metrology for control of polishing

Determination of gain for eddy current sensor

Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing

Inductive monitoring of conductive loops

Substrate features for inductive monitoring of conductive trench depth

Feedback of layer thickness timing and clearance timing for polishing control

Modifying substrate thickness profiles

Determination of gain for eddy current sensor

XU KUN

Temperature control of chemical mechanical polishing

Feedback control of polishing using optical detection of clearance

Metrology for GST film thickness and phase

GST film thickness monitoring

DAVID JEFFREY DRUE

Using optical metrology for wafer to wafer feed back process control

Using optical metrology for within wafer feed forward process control

Methods of using optical metrology for feed back and feed forward process control

ZHANG JIMIN

Detection of layer clearing using spectral monitoring

Endpoint detection during polishing using integrated differential intensity

Polishing control using weighting with default sequence

LAM RES CORP

System, method and apparatus for applying liquid to a CMP polishing pad

Polycide etch process

IRAVANI HASSAN G

High sensitivity eddy current monitoring system

WANG YOU

Chemical planarization of copper wafer polishing

DUBOUST ALAIN

Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing

TU WEN-CHIANG

Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery