Inventor
HEITZER LUDWIG
DE22 patents
⚠️ This page may combine multiple inventors who share the name “HEITZER LUDWIG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
17 patentsUS10043768B2Aug 7, 2018
Semiconductor device and method of manufacture thereof
INFINEON TECHNOLOGIES AG46 citations97
US7683460B2Mar 23, 2010
Module with a shielding and/or heat dissipating element
INFINEON TECHNOLOGIES AG54 citations97
US7714416B2May 11, 2010
Electronic circuit in a package-in-package configuration and production method
INFINEON TECHNOLOGIES AG8 citations84
US9881909B2Jan 30, 2018
Method for attaching a semiconductor die to a carrier
INFINEON TECHNOLOGIES AG4 citations73
US12158448B2Dec 3, 2024
Radiation source device
INFINEON TECHNOLOGIES AG2 citations71
US7547645B2Jun 16, 2009
Method for coating a structure comprising semiconductor chips
INFINEON TECHNOLOGIES AG2 citations62
US12405202B2Sep 2, 2025
Semiconductor device for particle measurement and method for operating the semiconductor device
INFINEON TECHNOLOGIES AG0 citations58
US7470601B2Dec 30, 2008
Semiconductor device with semiconductor chip and adhesive film and method for producing the same
INFINEON TECHNOLOGIES AG3 citations58
US9576935B2Feb 21, 2017
Method for fabricating a semiconductor package and semiconductor package
INFINEON TECHNOLOGIES AG0 citations52
US7919857B2Apr 5, 2011
Plastic housing and semiconductor component with said plastic housing
INFINEON TECHNOLOGIES AG0 citations52
US7834460B2Nov 16, 2010
Method for manufacturing an electronic component and corresponding electronic component
INFINEON TECHNOLOGIES AG0 citations52
US7749864B2Jul 6, 2010
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
INFINEON TECHNOLOGIES AG0 citations52
US7592236B2Sep 22, 2009
Method for applying a structure of joining material to the back surfaces of semiconductor chips
INFINEON TECHNOLOGIES AG0 citations52
US7294916B2Nov 13, 2007
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
INFINEON TECHNOLOGIES AG0 citations52
US12283538B2Apr 22, 2025
Molded semiconductor package having an embedded inlay
INFINEON TECHNOLOGIES AG0 citations46
US7662664B2Feb 16, 2010
Electronic circuit in a package-on-package configuration and method for producing the same
INFINEON TECHNOLOGIES AG0 citations41
US10571682B2Feb 25, 2020
Tilted chip assembly for optical devices
INFINEON TECHNOLOGIES AG0 citations39