P

Inventor

HEITZER LUDWIG

DE22 patents
⚠️ This page may combine multiple inventors who share the name “HEITZER LUDWIG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

17 patents
US10043768B2Aug 7, 2018

Semiconductor device and method of manufacture thereof

INFINEON TECHNOLOGIES AG46 citations97
US7683460B2Mar 23, 2010

Module with a shielding and/or heat dissipating element

INFINEON TECHNOLOGIES AG54 citations97
US7714416B2May 11, 2010

Electronic circuit in a package-in-package configuration and production method

INFINEON TECHNOLOGIES AG8 citations84
US9881909B2Jan 30, 2018

Method for attaching a semiconductor die to a carrier

INFINEON TECHNOLOGIES AG4 citations73
US12158448B2Dec 3, 2024

Radiation source device

INFINEON TECHNOLOGIES AG2 citations71
US7547645B2Jun 16, 2009

Method for coating a structure comprising semiconductor chips

INFINEON TECHNOLOGIES AG2 citations62
US12405202B2Sep 2, 2025

Semiconductor device for particle measurement and method for operating the semiconductor device

INFINEON TECHNOLOGIES AG0 citations58
US7470601B2Dec 30, 2008

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

INFINEON TECHNOLOGIES AG3 citations58
US9576935B2Feb 21, 2017

Method for fabricating a semiconductor package and semiconductor package

INFINEON TECHNOLOGIES AG0 citations52
US7919857B2Apr 5, 2011

Plastic housing and semiconductor component with said plastic housing

INFINEON TECHNOLOGIES AG0 citations52
US7834460B2Nov 16, 2010

Method for manufacturing an electronic component and corresponding electronic component

INFINEON TECHNOLOGIES AG0 citations52
US7749864B2Jul 6, 2010

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

INFINEON TECHNOLOGIES AG0 citations52
US7592236B2Sep 22, 2009

Method for applying a structure of joining material to the back surfaces of semiconductor chips

INFINEON TECHNOLOGIES AG0 citations52
US7294916B2Nov 13, 2007

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

INFINEON TECHNOLOGIES AG0 citations52
US12283538B2Apr 22, 2025

Molded semiconductor package having an embedded inlay

INFINEON TECHNOLOGIES AG0 citations46
US7662664B2Feb 16, 2010

Electronic circuit in a package-on-package configuration and method for producing the same

INFINEON TECHNOLOGIES AG0 citations41
US10571682B2Feb 25, 2020

Tilted chip assembly for optical devices

INFINEON TECHNOLOGIES AG0 citations39

MEYER THORSTEN

2 patents

BAUER MICHAEL

2 patents

INFINEON TECH DRESDEN GMBH & CO KG

1 patent