Inventor
CHINO TERUAKI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “CHINO TERUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
7 patentsUS7928557B2Apr 19, 2011
Stacked package and method for manufacturing the package
SHINKO ELECTRIC IND CO12 citations83
US9485864B2Nov 1, 2016
Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
SHINKO ELECTRIC IND CO10 citations82
US8610292B2Dec 17, 2013
Resin sealing method of semiconductor device
SHINKO ELECTRIC IND CO5 citations71
US8368235B2Feb 5, 2013
Resin sealing method of semiconductor device
SHINKO ELECTRIC IND CO2 citations61
US8344492B2Jan 1, 2013
Semiconductor device and method of manufacturing the same, and electronic apparatus
SHINKO ELECTRIC IND CO2 citations61
US9380712B2Jun 28, 2016
Wiring substrate and semiconductor device
SHINKO ELECTRIC IND CO0 citations51
US7985629B2Jul 26, 2011
Resin sealing method of semiconductor device
SHINKO ELECTRIC IND CO0 citations40
CHINO TERUAKI
4 patentsUS8536715B2Sep 17, 2013
Semiconductor device and method of manufacturing the same
CHINO TERUAKI11 citations82
US8431441B2Apr 30, 2013
Semiconductor package and method of manufacturing same
CHINO TERUAKI8 citations82
US8293576B2Oct 23, 2012
Semiconductor device and method of manufacturing the same
CHINO TERUAKI7 citations82
US8436471B2May 7, 2013
Semiconductor package with its surface edge covered by resin
CHINO TERUAKI2 citations60