Inventor
KAWASAKI HISAO
JP26 patents
⚠️ This page may combine multiple inventors who share the name “KAWASAKI HISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
11 patentsUS5382540AJan 17, 1995
Process for forming an electrically programmable read-only memory cell
MOTOROLA INC111 citations98
US5420072AMay 30, 1995
Method for forming a conductive interconnect in an integrated circuit
MOTOROLA INC101 citations95
US5358901AOct 25, 1994
Process for forming an intermetallic layer
MOTOROLA INC53 citations95
US5593919AJan 14, 1997
Process for forming a semiconductor device including conductive members
MOTOROLA INC24 citations92
US5506450AApr 9, 1996
Semiconductor device with improved electromigration resistance and method for making the same
MOTOROLA INC47 citations92
US5240558AAug 31, 1993
Method for forming a semiconductor device
MOTOROLA INC37 citations92
US5190893AMar 2, 1993
Process for fabricating a local interconnect structure in a semiconductor device
MOTOROLA INC33 citations92
US5393703AFeb 28, 1995
Process for forming a conductive layer for semiconductor devices
MOTOROLA INC37 citations91
US5623166AApr 22, 1997
Al-Ni-Cr conductive layer for semiconductor devices
MOTOROLA INC8 citations72
US5317185AMay 31, 1994
Semiconductor device having structures to reduce stress notching effects in conductive lines and method for making the same
MOTOROLA INC14 citations71
US6218733B1Apr 17, 2001
Semiconductor device having a titanium-aluminum compound
MOTOROLA INC11 citations70
KAWASAKI HISAO
6 patentsUS8587094B2Nov 19, 2013
Semiconductor device using a compound semiconductor subtrate
KAWASAKI HISAO8 citations83
US8253169B2Aug 28, 2012
Semiconductor device and manufacturing method for semiconductor device
KAWASAKI HISAO5 citations62
US8159027B2Apr 17, 2012
Semiconductor device
KAWASAKI HISAO2 citations62
US8338866B2Dec 25, 2012
Microwave semiconductor device using compound semiconductor and method for manufacturing the same
KAWASAKI HISAO0 citations51
US8084793B2Dec 27, 2011
Microwave semiconductor device using compound semiconductor and method for manufacturing the same
KAWASAKI HISAO0 citations51
US8307319B2Nov 6, 2012
Integrated circuit reliability
KAWASAKI HISAO0 citations30
TOSHIBA KK
6 patentsUS8030691B2Oct 4, 2011
Semiconductor device and manufacturing method therefor
TOSHIBA KK2 citations63
US7888713B2Feb 15, 2011
Semiconductor device and manufacturing method thereof
TOSHIBA KK4 citations63
US7622776B2Nov 24, 2009
Semiconductor device
TOSHIBA KK4 citations63
US7829919B2Nov 9, 2010
Semiconductor device
TOSHIBA KK1 citations52
US9269619B2Feb 23, 2016
Semiconductor device and method for manufacturing the same
TOSHIBA KK0 citations51
US7595531B2Sep 29, 2009
Semiconductor device
TOSHIBA KK0 citations42