Inventor
CADAG AARON
PH18 patents
⚠️ This page may combine multiple inventors who share the name “CADAG AARON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ST MICROELECTRONICS INC
17 patentsUS10079198B1Sep 18, 2018
QFN pre-molded leadframe having a solder wettable sidewall on each lead
ST MICROELECTRONICS INC34 citations92
US9953933B1Apr 24, 2018
Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die
ST MICROELECTRONICS INC7 citations83
US11069601B2Jul 20, 2021
Leadless semiconductor package with wettable flanks
ST MICROELECTRONICS INC2 citations71
US10128169B1Nov 13, 2018
Package with backside protective layer during molding to prevent mold flashing failure
ST MICROELECTRONICS INC3 citations71
US11557548B2Jan 17, 2023
Package with interlocking leads and manufacturing the same
ST MICROELECTRONICS INC2 citations70
US10903172B2Jan 26, 2021
Package with interlocking leads and manufacturing the same
ST MICROELECTRONICS INC2 citations70
US10529672B2Jan 7, 2020
Package with interlocking leads and manufacturing the same
ST MICROELECTRONICS INC1 citations70
US12255076B2Mar 18, 2025
Method for manufacturing leadless semiconductor package with wettable flanks
ST MICROELECTRONICS INC0 citations60
US11929259B2Mar 12, 2024
Method for manufacturing leadless semiconductor package with wettable flanks
ST MICROELECTRONICS INC0 citations60
US10910295B2Feb 2, 2021
QFN pre-molded leadframe having a solder wettable sidewall on each lead
ST MICROELECTRONICS INC0 citations60
US12543575B2Feb 3, 2026
Bottom package exposed die MEMS pressure sensor integrated circuit package design
ST MICROELECTRONICS INC0 citations59
US11355423B2Jun 7, 2022
Bottom package exposed die MEMS pressure sensor integrated circuit package design
ST MICROELECTRONICS INC0 citations59
US12211774B2Jan 28, 2025
Lead stabilization in semiconductor packages
ST MICROELECTRONICS INC0 citations50
US10541196B2Jan 21, 2020
QFN pre-molded leadframe having a solder wettable sidewall on each lead
ST MICROELECTRONICS INC0 citations50
US10461019B2Oct 29, 2019
Package with backside protective layer during molding to prevent mold flashing failure
ST MICROELECTRONICS INC0 citations50
US10483191B2Nov 19, 2019
Bottom package exposed die MEMS pressure sensor integrated circuit package design
ST MICROELECTRONICS INC0 citations48
US11916090B2Feb 27, 2024
Tapeless leadframe package with exposed integrated circuit die
ST MICROELECTRONICS INC0 citations44