Inventor

GUPTA SUBHASH

SG98 patents

⚠️ This page may combine multiple inventors who share the name “GUPTA SUBHASH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GUPTA SUBHASH

CHARTERED SEMICONDUCTOR MFG

Method to improve adhesion of organic dielectrics in dual damascene interconnects

Non-metallic barrier formation for copper damascene type interconnects

Method to create a copper diffusion deterrent interface

CMP process utilizing dummy plugs in damascene process

Reversed damascene process for multiple level metal interconnects

Method to avoid copper contamination during copper etching and CMP

Method to create a controllable and reproducible dual copper damascene structure

Method to avoid copper contamination on the sidewall of a via or a dual damascene structure

Non-metallic barrier formations for copper damascene type interconnects

Non-metallic barrier formations for copper damascene type interconnects

Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene

Method to create a copper dual damascene structure with less dishing and erosion

Method to deposit a copper seed layer for dual damascene interconnects

Method to form high performance copper damascene interconnects by de-coupling via and metal line filling

Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects

Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier

Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding

Non-metallic barrier formations for copper damascene type interconnects

Method of manufacturing embedded organic stop layer for dual damascene patterning

Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene

Method to create copper traps by modifying treatment on the dielectrics surface

Non metallic barrier formations for copper damascene type interconnects

Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding

Method for stripping copper in damascene interconnects

Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding

Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads

ADVANCED MICRO DEVICES INC

Dual damascene with a sacrificial via fill

Self aligned via dual damascene

Self aligned via dual damascene

Run-to-run control process for controlling critical dimensions

Subtractive dual damascene

Dual damascene with a protective mask for via etching

Semiconductor device including antireflective etch stop layer

Process for forming anti-reflective film for semiconductor fabrication using extremely short wavelength deep ultraviolet photolithography

Semiconductor device having an intermetallic layer on metal interconnects

Selective planarization method using regelation

Process for fabricating semiconductor device including antireflective etch stop layer

Method and system for providing inorganic vapor surface treatment for photoresist adhesion promotion

Deep UV anti-reflection coating etch

Fluted via formation for superior metal step coverage

Copper reservoir for reducing electromigration effects associated with a conductive via in a semiconductor device

Fluted via formation for superior metal step coverage

Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device

Dopant-independent polysilicon plasma etch

ANDERSEN CONSULTING

Demand scheduled partial carrier load planning system for the transportation industry

Airline seat inventory control method and apparatus for computerized airline reservation systems

TEXAS INSTRUMENTS INC

Speedup for solution of systems of linear equations

Methods for using a processor array to perform matrix calculations

GUPTA SUBHASH

Method of stripping layers of organic materials

TEXAS INSTR INCORPORATE

Method for calendaring future events in real-time