Inventor
HONG SANGKI
SG13 patents
⚠️ This page may combine multiple inventors who share the name “HONG SANGKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
9 patentsUS6376353B1Apr 23, 2002
Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects
CHARTERED SEMICONDUCTOR MFG319 citations99
US6284657B1Sep 4, 2001
Non-metallic barrier formation for copper damascene type interconnects
CHARTERED SEMICONDUCTOR MFG190 citations99
US6352917B1Mar 5, 2002
Reversed damascene process for multiple level metal interconnects
CHARTERED SEMICONDUCTOR MFG140 citations98
US6566260B2May 20, 2003
Non-metallic barrier formations for copper damascene type interconnects
CHARTERED SEMICONDUCTOR MFG32 citations96
US6489233B2Dec 3, 2002
Non-metallic barrier formations for copper damascene type interconnects
CHARTERED SEMICONDUCTOR MFG36 citations96
US6372636B1Apr 16, 2002
Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene
CHARTERED SEMICONDUCTOR MFG70 citations96
US6531390B2Mar 11, 2003
Non-metallic barrier formations for copper damascene type interconnects
CHARTERED SEMICONDUCTOR MFG19 citations92
US6429122B2Aug 6, 2002
Non metallic barrier formations for copper damascene type interconnects
CHARTERED SEMICONDUCTOR MFG25 citations92
US6225202B1May 1, 2001
Selective etching of unreacted nickel after salicidation
CHARTERED SEMICONDUCTOR MFG17 citations84