Inventor
YANG CHIH-KUANG
TW31 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHIH-KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PRINCO CORP
13 patentsUS8014164B2Sep 6, 2011
Hybrid structure of multi-layer substrates and manufacture method thereof
PRINCO CORP21 citations92
US7545042B2Jun 9, 2009
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
PRINCO CORP8 citations83
US10451654B2Oct 22, 2019
Probe card device
PRINCO CORP3 citations66
US8023282B2Sep 20, 2011
Hybrid structure of multi-layer substrates and manufacture method thereof
PRINCO CORP2 citations62
US7993973B2Aug 9, 2011
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
PRINCO CORP2 citations62
US7948079B2May 24, 2011
Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof
PRINCO CORP2 citations62
US7687312B2Mar 30, 2010
Method of manufacturing hybrid structure of multi-layer substrates
PRINCO CORP4 citations62
US7947573B2May 24, 2011
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
PRINCO CORP0 citations51
US7931973B2Apr 26, 2011
Manufacturing method of metal structure in multi-layer substrate and structure thereof
PRINCO CORP0 citations51
US7656679B2Feb 2, 2010
Multi-layer substrate and manufacture method thereof
PRINCO CORP0 citations51
US11221351B2Jan 11, 2022
Probe card device
PRINCO CORP0 citations47
US10622332B1Apr 14, 2020
Substrate separation system and method
PRINCO CORP0 citations41
US8051557B2Nov 8, 2011
Substrate with multi-layer interconnection structure and method of manufacturing the same
PRINCO CORP0 citations41
YANG CHIH-KUANG
9 patentsUS8405223B2Mar 26, 2013
Multi-layer via structure
YANG CHIH-KUANG3 citations62
US8288246B2Oct 16, 2012
Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
YANG CHIH-KUANG2 citations62
US8294039B2Oct 23, 2012
Surface finish structure of multi-layer substrate and manufacturing method thereof
YANG CHIH-KUANG3 citations53
US9398704B2Jul 19, 2016
Manufacturing method of metal structure of flexible multi-layer substrate
YANG CHIH-KUANG0 citations51
US9107315B2Aug 11, 2015
Via structure in multi-layer substrate
YANG CHIH-KUANG1 citations51
US8278562B2Oct 2, 2012
Multi-layer substrate and manufacturing method thereof
YANG CHIH-KUANG1 citations51
US8266797B2Sep 18, 2012
Method of manufacturing a multi-layer substrate
YANG CHIH-KUANG0 citations51
US8111519B2Feb 7, 2012
Hybrid structure of multi-layer substrates and manufacture method thereof
YANG CHIH-KUANG0 citations51
US8815333B2Aug 26, 2014
Manufacturing method of metal structure in multi-layer substrate
YANG CHIH-KUANG0 citations41
PRINCO MIDDLE EAST FZE
8 patentsUS9223296B2Dec 29, 2015
Wristwatch structure, electronic crown for wristwatch, and wristwatch having display
PRINCO MIDDLE EAST FZE111 citations96
US9256209B2Feb 9, 2016
Wristwatch structure, electronic core for wristwatch, and method for manufacturing wristwatch
PRINCO MIDDLE EAST FZE79 citations95
US9379089B2Jun 28, 2016
Electrical system and core module thereof
PRINCO MIDDLE EAST FZE4 citations71
US9182443B2Nov 10, 2015
Testing device and testing method thereof
PRINCO MIDDLE EAST FZE4 citations71
US9117792B2Aug 25, 2015
Chip thermal dissipation structure
PRINCO MIDDLE EAST FZE3 citations62
US8373070B2Feb 12, 2013
Metal structure of flexible multi-layer substrate and manufacturing method thereof
PRINCO MIDDLE EAST FZE2 citations62
US9501153B2Nov 22, 2016
Time adjusting method and system for wristwatch
PRINCO MIDDLE EAST FZE0 citations51
US9362199B2Jun 7, 2016
Chip thermal dissipation structure
PRINCO MIDDLE EAST FZE0 citations51