Inventor
SAGAWA TOSHIFUMI
JP2 patents
Patents
2 patentsUS9474191B2Oct 18, 2016
Power semiconductor module
HITACHI AUTOMOTIVE SYSTEMS LTD5 citations69
US9779976B2Oct 3, 2017
Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor
HITACHI AUTOMOTIVE SYSTEMS LTD0 citations45