Inventor

TAGAMI SHOHEI

JP33 patents

⚠️ This page may combine multiple inventors who share the name “TAGAMI SHOHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAGAMI SHOHEI

SHINETSU CHEMICAL CO

Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the method

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer temporary bonding method and thin wafer manufacturing method

Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer processing laminate and method for processing wafer

Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

Temporary adhesive composition and method for manufacturing thin wafer using the same

Polyimide silicone resin and thermosetting composition comprising the same

Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate

Wafer processing laminate and method for processing wafer

Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer

Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same

Silphenylene compound and process for producing the same

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Circuit substrate processing laminate and method for processing circuit substrate

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Chemically amplified positive resist composition and pattern forming process

FURUYA MASAHIRO

Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition

Temporary adhesive composition, and method of producing thin wafer

Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same

SUGO MICHIHIRO

Polyimide resin produced by using silphenylene compound

Polyimidesilicone having alcoholic hydroxyl group and process for producing the same

KATO HIDETO

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

TAGAMI SHOHEI

Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation