P

Inventor

TANABE MASAHITO

JP29 patents
⚠️ This page may combine multiple inventors who share the name “TANABE MASAHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU CHEMICAL CO

15 patents
US10128143B2Nov 13, 2018

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO9 citations84
US9646868B2May 9, 2017

Wafer temporary bonding method and thin wafer manufacturing method

SHINETSU CHEMICAL CO7 citations84
US10242902B2Mar 26, 2019

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO2 citations73
US9941145B2Apr 10, 2018

Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method

SHINETSU CHEMICAL CO4 citations73
US9934996B2Apr 3, 2018

Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method

SHINETSU CHEMICAL CO5 citations73
US9884979B2Feb 6, 2018

Temporary adhesion method and method for producing thin wafer

SHINETSU CHEMICAL CO3 citations73
US9263333B2Feb 16, 2016

Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer

SHINETSU CHEMICAL CO4 citations73
US12187989B2Jan 7, 2025

Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate

SHINETSU CHEMICAL CO0 citations62
US12168759B2Dec 17, 2024

Detergent composition, substrate cleaning method, and cleaning method for support or substrate

SHINETSU CHEMICAL CO0 citations62
US11183417B2Nov 23, 2021

Method for manufacturing laminate and method for manufacturing substrate

SHINETSU CHEMICAL CO1 citations62
US10950481B2Mar 16, 2021

Method for manufacturing thin substrate

SHINETSU CHEMICAL CO0 citations52
US10796939B2Oct 6, 2020

Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer

SHINETSU CHEMICAL CO0 citations52
US9887118B2Feb 6, 2018

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO0 citations52
US9334424B2May 10, 2016

Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer

SHINETSU CHEMICAL CO1 citations52
US10147632B2Dec 4, 2018

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

SHINETSU CHEMICAL CO0 citations42

TOKYO OHKA KOGYO CO LTD

12 patents
US5795702AAug 18, 1998

Photoresist stripping liquid compositions and a method of stripping photoresists using the same

TOKYO OHKA KOGYO CO LTD165 citations99
US5792274AAug 11, 1998

Remover solution composition for resist and method for removing resist using the same

TOKYO OHKA KOGYO CO LTD121 citations99
US5968848AOct 19, 1999

Process for treating a lithographic substrate and a rinse solution for the treatment

TOKYO OHKA KOGYO CO LTD97 citations98
US6261745B1Jul 17, 2001

Post-ashing treating liquid compositions and a process for treatment therewith

TOKYO OHKA KOGYO CO LTD71 citations96
US6068000AMay 30, 2000

Substrate treatment method

TOKYO OHKA KOGYO CO LTD62 citations96
US5905063AMay 18, 1999

Remover solution composition for resist and method for removing resist using the same

TOKYO OHKA KOGYO CO LTD81 citations96
US6136505AOct 24, 2000

Liquid coating composition for use in forming antireflective film and photoresist material using said antireflective film

TOKYO OHKA KOGYO CO LTD21 citations93
US6291142B1Sep 18, 2001

Photoresist stripping liquid compositions and a method of stripping photoresists using the same

TOKYO OHKA KOGYO CO LTD17 citations92
US6225034B1May 1, 2001

Photoresist stripping liquid compositions and a method of stripping photoresists using the same

TOKYO OHKA KOGYO CO LTD20 citations92
US6225030B1May 1, 2001

Post-ashing treating method for substrates

TOKYO OHKA KOGYO CO LTD22 citations92
US6218087B1Apr 17, 2001

Photoresist stripping liquid composition and a method of stripping photoresists using the same

TOKYO OHKA KOGYO CO LTD23 citations92
US6132928AOct 17, 2000

Coating solution for forming antireflective coating film

TOKYO OHKA KOGYO CO LTD14 citations74

TOKYO OHIKA KOGYO CO LTD

1 patent

TOPPAN PRINTING CO LTD

1 patent