Inventor
TANABE MASAHITO
JP29 patents
⚠️ This page may combine multiple inventors who share the name “TANABE MASAHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
15 patentsUS10128143B2Nov 13, 2018
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO9 citations84
US9646868B2May 9, 2017
Wafer temporary bonding method and thin wafer manufacturing method
SHINETSU CHEMICAL CO7 citations84
US10242902B2Mar 26, 2019
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO2 citations73
US9941145B2Apr 10, 2018
Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method
SHINETSU CHEMICAL CO4 citations73
US9934996B2Apr 3, 2018
Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method
SHINETSU CHEMICAL CO5 citations73
US9884979B2Feb 6, 2018
Temporary adhesion method and method for producing thin wafer
SHINETSU CHEMICAL CO3 citations73
US9263333B2Feb 16, 2016
Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
SHINETSU CHEMICAL CO4 citations73
US12187989B2Jan 7, 2025
Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate
SHINETSU CHEMICAL CO0 citations62
US12168759B2Dec 17, 2024
Detergent composition, substrate cleaning method, and cleaning method for support or substrate
SHINETSU CHEMICAL CO0 citations62
US11183417B2Nov 23, 2021
Method for manufacturing laminate and method for manufacturing substrate
SHINETSU CHEMICAL CO1 citations62
US10950481B2Mar 16, 2021
Method for manufacturing thin substrate
SHINETSU CHEMICAL CO0 citations52
US10796939B2Oct 6, 2020
Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer
SHINETSU CHEMICAL CO0 citations52
US9887118B2Feb 6, 2018
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO0 citations52
US9334424B2May 10, 2016
Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer
SHINETSU CHEMICAL CO1 citations52
US10147632B2Dec 4, 2018
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
SHINETSU CHEMICAL CO0 citations42
TOKYO OHKA KOGYO CO LTD
12 patentsUS5795702AAug 18, 1998
Photoresist stripping liquid compositions and a method of stripping photoresists using the same
TOKYO OHKA KOGYO CO LTD165 citations99
US5792274AAug 11, 1998
Remover solution composition for resist and method for removing resist using the same
TOKYO OHKA KOGYO CO LTD121 citations99
US5968848AOct 19, 1999
Process for treating a lithographic substrate and a rinse solution for the treatment
TOKYO OHKA KOGYO CO LTD97 citations98
US6261745B1Jul 17, 2001
Post-ashing treating liquid compositions and a process for treatment therewith
TOKYO OHKA KOGYO CO LTD71 citations96
US6068000AMay 30, 2000
Substrate treatment method
TOKYO OHKA KOGYO CO LTD62 citations96
US5905063AMay 18, 1999
Remover solution composition for resist and method for removing resist using the same
TOKYO OHKA KOGYO CO LTD81 citations96
US6136505AOct 24, 2000
Liquid coating composition for use in forming antireflective film and photoresist material using said antireflective film
TOKYO OHKA KOGYO CO LTD21 citations93
US6291142B1Sep 18, 2001
Photoresist stripping liquid compositions and a method of stripping photoresists using the same
TOKYO OHKA KOGYO CO LTD17 citations92
US6225034B1May 1, 2001
Photoresist stripping liquid compositions and a method of stripping photoresists using the same
TOKYO OHKA KOGYO CO LTD20 citations92
US6225030B1May 1, 2001
Post-ashing treating method for substrates
TOKYO OHKA KOGYO CO LTD22 citations92
US6218087B1Apr 17, 2001
Photoresist stripping liquid composition and a method of stripping photoresists using the same
TOKYO OHKA KOGYO CO LTD23 citations92
US6132928AOct 17, 2000
Coating solution for forming antireflective coating film
TOKYO OHKA KOGYO CO LTD14 citations74