Inventor

SCHLOEGEL XAVER

DE62 patents

⚠️ This page may combine multiple inventors who share the name “SCHLOEGEL XAVER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHLOEGEL XAVER

INFINEON TECHNOLOGIES AG

Semiconductor module

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Semiconductor module

Semiconductor module

Stacked semiconductor chips with separate encapsulations

Semiconductor device

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

Electrically conductive connection, electronic component and method for their production

Method for making a device including placing a semiconductor chip on a substrate

Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit

Chip arrangements and methods for manufacturing a chip arrangement

Semiconductor component having a semiconductor die and a leadframe

Semiconductor device comprising a vertical semiconductor component and method for producing the same

Electronic component with isolation barriers between the terminal pins

Two-chip power IC having an improved short-circuit response

Semiconductor package system

Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package

Module comprising a semiconductor chip

Semiconductor module for a switched-mode power supply and method for its assembly

Semiconductor housing with rear-side structuring

Semiconductor packages having multiple lead frames and methods of formation thereof

Method for manufacturing a chip arrangement

Electronic device and method for fabricating an electronic device

Chip module, an insulation material and a method for fabricating a chip module

OTREMBA RALF

Semiconductor module

Semiconductor device and method for producing the same

Module comprising a semiconductor chip

Semiconductor device using diffusion soldering

Multichip module with improved system carrier

Semiconductor packages having multiple lead frames and methods of formation thereof

Power semiconductor chip having two metal layers on one face

Module with silicon-based layer

Stacked semiconductor chips with separate encapsulations

Lateral element isolation device

Package-in-packages and methods of formation thereof

INFINEON TECHNOLOGIES AUSTRIA AG

Multi-chip semiconductor power device

Semiconductor chip package having a repeating footprint pattern

SMD package with top side cooling

Power semiconductor system having an inductor module attached to a power stage module

Method of manufacturing a power semiconductor system

Method of producing an SMD package with top side cooling

Chip carrier structure, chip package and method of manufacturing the same

INFINEON TECHNOLOGIES AUSTRIA

Semiconductor power device having a heat sink

Power transistor arrangement and method for manufacturing the same

Electronic device

Power transistor arrangement and package having the same

Package arrangement and a method of manufacturing a package arrangement

SIEMENS AG

Semiconductor component with insulating housing

Arrangement of electronic components on a bearer strip

HOEGLAUER JOSEF

Chip module and a method for manufacturing a chip module