Inventor
HWANG HO-YUNG DAVID
US34 patents
⚠️ This page may combine multiple inventors who share the name “HWANG HO-YUNG DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
11 patentsUS10910381B2Feb 2, 2021
Multicolor approach to DRAM STI active cut patterning
APPLIED MATERIALS INC1 citations73
US12550647B2Feb 10, 2026
Electrode tuning, depositing, and etching methods
APPLIED MATERIALS INC0 citations62
US12387927B2Aug 12, 2025
Deposition of boron films
APPLIED MATERIALS INC0 citations62
US11638374B2Apr 25, 2023
Multicolor approach to DRAM STI active cut patterning
APPLIED MATERIALS INC0 citations62
US11508618B2Nov 22, 2022
Multicolor self-aligned contact selective etch
APPLIED MATERIALS INC0 citations62
US11437238B2Sep 6, 2022
Patterning scheme to improve EUV resist and hard mask selectivity
APPLIED MATERIALS INC0 citations62
US11335690B2May 17, 2022
Multicolor approach to DRAM STI active cut patterning
APPLIED MATERIALS INC0 citations62
US11094589B2Aug 17, 2021
Multicolor self-aligned contact selective etch
APPLIED MATERIALS INC0 citations62
US11869807B2Jan 9, 2024
Fully self-aligned subtractive etch
APPLIED MATERIALS INC1 citations60
US11508617B2Nov 22, 2022
Method of forming interconnect for semiconductor device
APPLIED MATERIALS INC0 citations52
US11139205B2Oct 5, 2021
Self-aligned subtractive interconnect patterning
APPLIED MATERIALS INC0 citations52
MICROMATERIALS LLC
8 patentsUS10510540B2Dec 17, 2019
Mask scheme for cut pattern flow with enlarged EPE window
MICROMATERIALS LLC11 citations84
US10600688B2Mar 24, 2020
Methods of producing self-aligned vias
MICROMATERIALS LLC6 citations73
US10593594B2Mar 17, 2020
Selectively etched self-aligned via processes
MICROMATERIALS LLC2 citations73
US10699953B2Jun 30, 2020
Method for creating a fully self-aligned via
MICROMATERIALS LLC1 citations62
US11437274B2Sep 6, 2022
Fully self-aligned via
MICROMATERIALS LLC1 citations59
US10410921B2Sep 10, 2019
Fully self-aligned via
MICROMATERIALS LLC0 citations52
US11164938B2Nov 2, 2021
DRAM capacitor module
MICROMATERIALS LLC0 citations51
US10510602B2Dec 17, 2019
Methods of producing self-aligned vias
MICROMATERIALS LLC0 citations41
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS10558120B2Feb 11, 2020
System and method for supplying and dispensing bubble-free photolithography chemical solutions
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12025917B2Jul 2, 2024
System and method for supplying and dispensing bubble-free photolithography chemical solutions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12196491B2Jan 14, 2025
Adaptive baking method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11204200B2Dec 21, 2021
Adaptive baking method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10006717B2Jun 26, 2018
Adaptive baking system and method of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9817315B2Nov 14, 2017
System and method for supplying and dispensing bubble-free photolithography chemical solutions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10274839B2Apr 30, 2019
Two-dimensional marks
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US9690212B2Jun 27, 2017
Hybrid focus-exposure matrix
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
CHEN CHI-MING
6 patentsUS8476146B2Jul 2, 2013
Reducing wafer distortion through a low CTE layer
CHEN CHI-MING134 citations98
US8624326B2Jan 7, 2014
FinFET device and method of manufacturing same
CHEN CHI-MING29 citations92
US8772831B2Jul 8, 2014
III-nitride growth method on silicon substrate
CHEN CHI-MING4 citations72
US9123671B2Sep 1, 2015
Silicon wafer strength enhancement
CHEN CHI-MING2 citations63
US8723185B2May 13, 2014
Reducing wafer distortion through a high CTE layer
CHEN CHI-MING2 citations63
US8791504B2Jul 29, 2014
Substrate breakdown voltage improvement for group III-nitride on a silicon substrate
CHEN CHI-MING2 citations62