Inventor

HALUZAK CHARLES C

US61 patents

⚠️ This page may combine multiple inventors who share the name “HALUZAK CHARLES C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HALUZAK CHARLES C

HEWLETT PACKARD DEVELOPMENT CO

Multi-level integrated circuit for wide-gap substrate bonding

System and method for direct-bonding of substrates

Microfluidic device and a fluid ejection device incorporating the same

Drop generator for ultra-small droplets

System and method for direct-bonding of substrates

Fluidic MEMS device

Method of forming a printhead using a silicon on insulator substrate

Thermal drop generator for ultra-small droplets

Multi-level integrated circuit for wide-gap substrate bonding

System and methods for hermetic sealing of post media-filled MEMS package

Micro-optoelectromechanical system packages for a light modulator and methods of making the same

Substrate and method of forming substrate for fluid ejection device

Flextensional transducer and method of forming flextensional transducer

Electro-wetting on dielectric for pin-style fluid delivery

Package having bond-sealed underbump

Drop generator for ultra-small droplets

Method of fabricating a fluid ejection device

Fluid ejection device with a composite substrate

Method for forming a fluid ejection device

Micro electrical mechanical system

Substrate and method of forming substrate for fluid ejection device

Method of forming a printhead

MEMS packaging structure and methods

Package having bond-sealed underbump

Multi-element thin-film fuel cell

Microfluidic device and a fluid ejection device incorporating the same

Bonding interface for micro-device packaging

Micro-displays and their manufacture

Assembly with a ring and bonding pads formed of a same material on a substrate

Micro-electromechanical system

Methods of controlling flow

HEWLETT PACKARD CO

Self-cleaning titanium dioxide coated ink-jet printer head

Printing structure with insulator layer

In-situ fluid jet orifice

Feature in firing chamber of fluid ejection device

In-situ fluid jet orifice

Ink feed trench etch technique for a fully integrated thermal inkjet printhead

Method and apparatus for simultaneously forming a plurality of openings through a substrate

MATTHEWS INT CORP

Systems and methods for sealing micro-valves for use in jetting assemblies

Systems and methods for controlling operation of micro-valves for use in jetting assemblies

Electrode structures for micro-valves for use in jetting assemblies

Systems and methods for controlling operation of micro-valves for use in jetting assemblies

Systems and methods for sealing micro-valves for use in jetting assemblies

Systems and methods for controlling operation of micro-valves for use in jetting assemblies

Methods of fabricating micro-valves and jetting assemblies including such micro-valves

VIDEOJET TECHNOLOGIES INC

Thermal inkjet print head with solvent resistance

Thermal inkjet print head with solvent resistance

(unassigned)

Flextensional transducer and method of forming flextensional transducer

HEWLETT PACKARD DEVELOPMENT LP

Microelectronic device

LAMBRIGHT TERRY M

Thermal inkjet print head with solvent resistance