P

Inventor

KIM DONG YEONG

KR20 patents
⚠️ This page may combine multiple inventors who share the name “KIM DONG YEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

18 patents
US11501922B2Nov 15, 2022

Multilayer electronic component for enhanced moisture resistance and bending strength

SAMSUNG ELECTRO MECH6 citations85
US11183332B2Nov 23, 2021

Multilayer electronic component

SAMSUNG ELECTRO MECH14 citations85
US11600443B2Mar 7, 2023

Multilayer electronic component

SAMSUNG ELECTRO MECH4 citations74
US11380488B2Jul 5, 2022

Multilayer electronic component for enhanced moisture resistance and bending strength

SAMSUNG ELECTRO MECH4 citations73
US12362100B2Jul 15, 2025

Multilayer electronic component for enhanced moisture resistance and bending strength

SAMSUNG ELECTRO MECH0 citations62
US11862404B2Jan 2, 2024

Multilayer electronic component for enhanced moisture resistance and bending strength

SAMSUNG ELECTRO MECH1 citations62
US11837412B2Dec 5, 2023

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11817271B2Nov 14, 2023

Multilayer electronic component including a silicon organic compound layer arranged between layers of an external electrode

SAMSUNG ELECTRO MECH1 citations62
US11817259B2Nov 14, 2023

Multi-layered ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11784002B2Oct 10, 2023

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11335506B2May 17, 2022

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11101074B2Aug 24, 2021

Ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US11094466B2Aug 17, 2021

Multi-layered ceramic electronic component

SAMSUNG ELECTRO MECH0 citations62
US12198863B2Jan 14, 2025

Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrode

SAMSUNG ELECTRO MECH0 citations60
US11721486B2Aug 8, 2023

Multilayer ceramic electronic component having specified thickness ratio for different portions of external electrode

SAMSUNG ELECTRO MECH1 citations60
US11056284B2Jul 6, 2021

Multi-layered ceramic electronic component

SAMSUNG ELECTRO MECH1 citations59
US11011311B2May 18, 2021

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations51
US11996242B2May 28, 2024

Multilayer capacitor

SAMSUNG ELECTRO MECH0 citations43

HYUNDAI MOBIS CO LTD

1 patent

SAMSUNG SDS CO LTD

1 patent