Inventor

LAZOVSKY DAVID

US20 patents

⚠️ This page may combine multiple inventors who share the name “LAZOVSKY DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAZOVSKY DAVID

CELESTIAL AI INC

Optical multi-die interconnect bridge (OMIB)

Optically bridged multicomponent package with extended temperature range

Multicomponent photonically intra-die bridged assembly

Optical bridging element for separately stacked electrical ICs

Optical multi-die interconnect bridge with optical interface

Balanced photonic architectures for matrix computations

Coherent photonic computing architectures

Stacked-dies optically bridged multicomponent package

Optically bridged multicomponent package with extended temperature range

Optically bridged multicomponent package with extended temperature range

Optically bridged multicomponent package with extended temperature range

Optically bridged multicomponent package with extended temperature range

Optically bridged multicomponent package with extended temperature range

Multicomponent photonically bridged assembly

Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages

Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packages

Optically bridged multicomponent package with extended temperature range

Optical multi-die interconnect bridge with electrical and optical interfaces

Photonic memory fabric for system memory interconnection

PRAMANIK DIPANKAR

Creating an embedded reram memory from a high-K metal gate transistor structure