Inventor
KIMURA YASUHIRO
JP45 patents
⚠️ This page may combine multiple inventors who share the name “KIMURA YASUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
12 patentsUS6232201B1May 15, 2001
Semiconductor substrate processing method
MITSUBISHI ELECTRIC CORP24 citations92
US5876819AMar 2, 1999
Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same
MITSUBISHI ELECTRIC CORP32 citations90
US5946543AAug 31, 1999
Semiconductor wafer evaluating method and semiconductor device manufacturing method
MITSUBISHI ELECTRIC CORP24 citations85
US10559508B2Feb 11, 2020
Method for manufacturing SiC substrate
MITSUBISHI ELECTRIC CORP2 citations73
US6563172B2May 13, 2003
Semiconductor substrate processing method
MITSUBISHI ELECTRIC CORP12 citations73
US5928786AJul 27, 1999
Monocrystalline silicon wafer and method of thermally oxidizing a surface thereof
MITSUBISHI ELECTRIC CORP7 citations73
US10858757B2Dec 8, 2020
Silicon carbide epitaxial substrate and silicon carbide semiconductor device
MITSUBISHI ELECTRIC CORP2 citations72
US10964785B2Mar 30, 2021
SiC epitaxial wafer and manufacturing method of the same
MITSUBISHI ELECTRIC CORP0 citations62
US10707075B2Jul 7, 2020
Semiconductor wafer, semiconductor device, and method for producing semiconductor device
MITSUBISHI ELECTRIC CORP1 citations61
US10950435B2Mar 16, 2021
SiC epitaxial wafer, method for manufacturing SiC epitaxial wafer, SiC device, and power conversion apparatus
MITSUBISHI ELECTRIC CORP1 citations60
US6461447B1Oct 8, 2002
Substrate for epitaxial growth
MITSUBISHI ELECTRIC CORP2 citations60
US9564315B1Feb 7, 2017
Manufacturing method and apparatus for manufacturing silicon carbide epitaxial wafer
MITSUBISHI ELECTRIC CORP1 citations50
TOSHIBA KK
9 patentsUS7383348B2Jun 3, 2008
Data transfer scheme using caching technique for reducing network load
TOSHIBA KK89 citations98
US7359956B2Apr 15, 2008
Data transfer scheme using caching and differential compression techniques for reducing network load
TOSHIBA KK94 citations98
US6023287AFeb 8, 2000
Method and apparatus for image selection in image transmission system
TOSHIBA KK21 citations93
US7054912B2May 30, 2006
Data transfer scheme using caching technique for reducing network load
TOSHIBA KK37 citations92
US7334023B2Feb 19, 2008
Data transfer scheme for reducing network load using general purpose browser on client side
TOSHIBA KK13 citations82
US7069297B2Jun 27, 2006
Data transfer scheme using re-direct response message for reducing network load
TOSHIBA KK16 citations82
US7480731B2Jan 20, 2009
Data transfer scheme using caching technique for reducing network load
TOSHIBA KK3 citations63
US7636765B2Dec 22, 2009
Data transfer scheme using caching technique for reducing network load
TOSHIBA KK0 citations52
US7441248B2Oct 21, 2008
Data transfer scheme using caching technique for reducing network load
TOSHIBA KK0 citations42
IBM
6 patentsUS6538709B1Mar 25, 2003
LCD panel including plurality of display panel parts wrapped around by a thin plastic film envelope with an opening
IBM209 citations99
US6597427B1Jul 22, 2003
Liquid crystal panel, display device, identification mark detection device, detection display system, TFT array repair device and identification mark detection method
IBM77 citations97
US6069620AMay 30, 2000
Driving method of liquid crystal display device
IBM125 citations96
US5892494AApr 6, 1999
Correction of LCD drive voltage in dependence upon LCD switching element turn on time between polarity changes
IBM41 citations92
US5724057AMar 3, 1998
Method and apparatus for driving a liquid crystal display
IBM45 citations92
US6008786ADec 28, 1999
Method for driving halftone display for a liquid crystal display
IBM25 citations91
RENESAS TECH CORP
3 patentsUS6872979B2Mar 29, 2005
Semiconductor substrate with stacked oxide and SOI layers with a molten or epitaxial layer formed on an edge of the stacked layers
RENESAS TECH CORP13 citations92
US6768542B2Jul 27, 2004
Defect inspecting device for substrate to be processed and method of manufacturing semiconductor device
RENESAS TECH CORP18 citations81
US6747337B1Jun 8, 2004
Semiconductor wafer with a dicing line overlapping a defect
RENESAS TECH CORP5 citations63
AJINOMOTO KK
2 patentsNOF CORP
2 patentsUS6254973B1Jul 3, 2001
Fluorine-containing polyfunctional (meth) acrylate, fluorine containing monomer composition, low refractivity material, and reflection reducing film
NOF CORP20 citations92
US6087010AJul 11, 2000
Fluorine-containing polyfunctional (meth) acrylate composition low refractivity material and reflection reducing film
NOF CORP25 citations92