Inventor
IIDA SHINYA
JP20 patents
⚠️ This page may combine multiple inventors who share the name “IIDA SHINYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
7 patentsUS4745088AMay 17, 1988
Vapor phase growth on semiconductor wafers
HITACHI LTD213 citations98
US4289188ASep 15, 1981
Method and apparatus for monitoring etching
HITACHI LTD60 citations95
US4412119AOct 25, 1983
Method for dry-etching
HITACHI LTD32 citations92
US4267013AMay 12, 1981
Method for dry-etching aluminum and aluminum alloys
HITACHI LTD48 citations89
US4308089ADec 29, 1981
Method for preventing corrosion of Al and Al alloys
HITACHI LTD27 citations80
US4427515AJan 24, 1984
Surface acoustic wave device and method for manufacturing the same
HITACHI LTD18 citations73
US4352974AOct 5, 1982
Plasma etcher having isotropic subchamber with gas outlet for producing uniform etching
HITACHI LTD14 citations73
SPEEDFAM CO LTD
6 patentsUS6159388ADec 12, 2000
Plasma etching method and plasma etching system for carrying out the same
SPEEDFAM CO LTD26 citations92
US6126531AOct 3, 2000
Slurry recycling system of CMP apparatus and method of same
SPEEDFAM CO LTD47 citations92
US5980769ANov 9, 1999
Plasma etching method
SPEEDFAM CO LTD35 citations92
US6254718B1Jul 3, 2001
Combined CMP and plasma etching wafer flattening system
SPEEDFAM CO LTD9 citations72
US6496748B1Dec 17, 2002
Wafer flattening process and storage medium
SPEEDFAM CO LTD2 citations63
US6316369B1Nov 13, 2001
Corrosion-resistant system and method for a plasma etching apparatus
SPEEDFAM CO LTD6 citations63