Inventor
ISHIBASHI TAKEO
JP25 patents
⚠️ This page may combine multiple inventors who share the name “ISHIBASHI TAKEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
14 patentsUS6579657B1Jun 17, 2003
Material for forming a fine pattern and method for manufacturing a semiconductor device using the same
MITSUBISHI ELECTRIC CORP169 citations98
US5858620AJan 12, 1999
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP267 citations98
US6319853B1Nov 20, 2001
Method of manufacturing a semiconductor device using a minute resist pattern, and a semiconductor device manufactured thereby
MITSUBISHI ELECTRIC CORP136 citations97
US6180320B1Jan 30, 2001
Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured thereby
MITSUBISHI ELECTRIC CORP70 citations95
US5451479ASep 19, 1995
Method of forming a pattern of a multilayer type semiconductor device
MITSUBISHI ELECTRIC CORP36 citations92
US6593063B1Jul 15, 2003
Method of manufacturing a semiconductor device having an improved fine structure
MITSUBISHI ELECTRIC CORP42 citations91
US6376157B1Apr 23, 2002
Method of manufacturing a semiconductor device, chemical solution to form fine pattern, and semiconductor device
MITSUBISHI ELECTRIC CORP26 citations91
US6566040B1May 20, 2003
Method of manufacturing a semiconductor device and semiconductor device manufactured by the method
MITSUBISHI ELECTRIC CORP25 citations89
US5554489ASep 10, 1996
Method of forming a fine resist pattern using an alkaline film covered photoresist
MITSUBISHI ELECTRIC CORP23 citations88
US6589880B2Jul 8, 2003
Fine pattern formation method and semiconductor device or liquid crystal device manufacturing method employing this method
MITSUBISHI ELECTRIC CORP8 citations74
US6133138AOct 17, 2000
Method of manufacturing semiconductor device having multilayer interconnection structure
MITSUBISHI ELECTRIC CORP7 citations74
US6374397B1Apr 16, 2002
Lot determination apparatus, lot determination method, and recording medium for storing the method
MITSUBISHI ELECTRIC CORP12 citations73
US6171761B1Jan 9, 2001
Resist pattern forming method utilizing multiple baking and partial development steps
MITSUBISHI ELECTRIC CORP13 citations73
US7030007B2Apr 18, 2006
Via-filling material and process for fabricating semiconductor integrated circuit using the material
MITSUBISHI ELECTRIC CORP3 citations61
RENESAS TECH CORP
5 patentsUS7459265B2Dec 2, 2008
Pattern forming method, semiconductor device manufacturing method and exposure mask set
RENESAS TECH CORP10 citations82
US6815142B1Nov 9, 2004
Method for forming resist pattern, and overlying layer material and semiconductor device used for forming resist pattern
RENESAS TECH CORP12 citations69
US7727709B2Jun 1, 2010
Method of forming resist pattern and method of manufacturing semiconductor device
RENESAS TECH CORP2 citations61
US7670756B2Mar 2, 2010
Pattern forming method, semiconductor device manufacturing method and exposure mask set
RENESAS TECH CORP4 citations61
US7544619B2Jun 9, 2009
Method of fabricating semiconductor device
RENESAS TECH CORP0 citations52
ISHIBASHI TAKEO
2 patentsUS8092703B2Jan 10, 2012
Manufacturing method of semiconductor device
ISHIBASHI TAKEO40 citations91
US8178983B2May 15, 2012
Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same
ISHIBASHI TAKEO3 citations57