Inventor

LIN WEI-FENG

TW73 patents

⚠️ This page may combine multiple inventors who share the name “LIN WEI-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN WEI-FENG

OMNIVISION TECH INC

Image sensor package to limit package height and reduce edge flare

Curved image sensor systems and methods for manufacturing the same

System-in-package image sensor

Image sensor packages with folded cover-glass sealing interface

Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the same

Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the same

Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the same

Wafer-level encapsulated semiconductor device, and method for fabricating same

Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs

Image-sensor package and associated method

Cover-glass-free array camera with individually light-shielded cameras

Multi-projector display box for use in retail marketing

Aerogel-encapsulated image sensor and manufacturing method for same

Chip-scale packaged image sensor packages with black masking and associated packaging methods

System-in-package image sensor

Medical micro-cable structure and connection method with mini camera cube chip

Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes

Apparatus and method for curved-surface image sensor

Electronic camera module with integral LED and light-pipe illuminator

Laser marked code pattern for representing tracing number of chip

Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture

Semiconductor structure and method of manufacturing the same

Diffractive optical elements made of conductive materials

Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same

Anti-reflective coating with high refractive index material at air interface

Image sensor package

SILICON INTEGRATED SYS CORP

Multi-layered substrate with a built-in capacitor design

Multi-layered substrate with a built-in capacitor design and a method of making the same

Bond pad structure and its method of fabricating

Bond pad structure and its method of fabricating

Tray for ball grid array devices

Chip carrier having a specific power join distribution structure

Flip chip package structure

Semiconductor chip with partially embedded decoupling capacitors

Apparatus for reducing an electrical noise inside a ball grid array package

Die paddle for receiving an integrated circuit die in a plastic substrate

Substrate for semiconductor package

Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging

Integrated circuit bonding device and manufacturing method thereof

Substrates for semiconductor devices with shielding for NC contacts

Method of arranging the staggered shape bond pads layers for effectively reducing the size of a die

Padless high density circuit board

Integrated circuit package capable of improving signal quality

Flip chip assembly process for forming an underfill encapsulant

Chip-packaging substrate and test method therefor

Semiconductor devices and substrates used in thereof

Jigs for semiconductor components

SILICON INTERGRATED SYSTEMS CO

Ball grid array package with heat sink device

CHIEN YEH-AN

Apparatus and method for using spacer paste to package an image sensor

DU ZHENG

Enclosure for image capture systems with focusing capabilities